Lenovo ThinkServer RD450 User Manual

7.Touchthestatic-protectivepackagethatcontainsthenewheatsinktoanyunpaintedsurfaceonthe
outsideoftheserver.Then,removethenewheatsinkfromthepackage.
8.Removeanyprotectivecoverthatprotectsthethermalgreaseonthebottomofthenewheatsink.Then,
placethenewheatsinkonthesystemboardsothatthefourscrewsonthenewheatsinkarealigned
withthecorrespondingmountingstudsonthesystemboard.
9.Installthefourscrewstosecurethenewheatsinkonthesystemboard.Itisrecommendedthatyou
carefullyinstallthefourscrewsusingthefollowingmethodtoavoidanypossibledamagetothesystem
board.
a.Partiallytightenscrew1,thenfirmlytightenscrew3,andthenreturntoscrew1andfirmlytighten
it.Donotover-tightenthescrews.
b.Partiallytightenscrew2,thenfirmlytightenscrew4,andthenreturntoscrew2andfirmlytighten
it.Donotover-tightenthescrews.
1 2
3
4
Figure94.Installingthescrewstosecuretheheatsink
10.Ifyouareinstructedtoreturntheoldheatsink,followallpackaginginstructionsanduseanypackaging
materialsthataresuppliedtoyouforshipping.
Whattodonext:
•Toworkwithanotherpieceofhardware,gototheappropriatesection.
•Tocompletetheinstallationorreplacement,goto“Completingthepartsreplacement”onpage178
.
Installingorreplacingthemicroprocessor
Thistopiccontainsthefollowinginformation:
•“Installingthesecondmicroprocessor”onpage126
•“Replacingthemicroprocessor”onpage130
Installingthesecondmicroprocessor
Attention:Donotopenyourserverorattemptanyrepairbeforereadingandunderstanding“Safetyinformation”
onpageiiiand“Guidelines”onpage63.
Dependingonthemodel,yourservermightcomewithoneortwomicroprocessors.Forservermodelswith
onemicroprocessor,themicroprocessorisinstalledinthemicroprocessorsocket1andthemicroprocessor
126ThinkServerRD450UserGuideandHardwareMaintenanceManual

Lenovo ThinkServer RD450 Specifications

General

Tcase	70.9 °C
Bus type	QPI
Stepping	M1
FSB Parity	No
Scalability	2S
Processor cache	15 MB
Processor cores	6
Processor model	E5-2609V3
System bus rate	6.4 GT/s
Processor series	Intel Xeon E5-2600 v3
Processor socket	LGA 2011-v3
Processor codename	Haswell
Processor frequency	1.9 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	52.5 x 45 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
PCI Express configurations	x4, x8, x16
Supported instruction sets	AVX 2.0
Thermal Design Power (TDP)	85 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
Maximum number of SMP processors	2
Maximum number of PCI Express lanes	40
Memory types supported by processor	DDR4-SDRAM
Memory channels supported by processor	Quad
Memory clock speeds supported by processor	1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	51 GB/s
Maximum internal memory supported by processor	768 GB
Intelligent Platform Management Interface (IPMI) support	Yes
HDD size	- \
RAID levels	0, 1, 10
HDD interface	-
Optical drive type	DVD±RW
Supported HDD sizes	2.5 \
Total storage capacity	0 GB
Maximum storage capacity	28.8 TB
Number of HDDs installed	0
Number of HDDs supported	8
Supported storage drive interfaces	SAS, Serial ATA
Memory slots	16
Internal memory	8 GB
Memory clock speed	2133 MHz
Maximum internal memory	512 GB
Memory layout (slots x size)	1 x 8 GB
Graphics card	AST2400
Security features	Power-on & administrator password
Graphics card family	Aspeed
Cabling technology	10/100/1000Base-T(X)
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports	3
PCI Express slots version	3.0
Compatible operating systems	Microsoft Windows Server 2012 R2, 2012, and 2008 R2, Windows Small\\r Business Server 2011, Windows Server Storage 2012 R2 and 2012, Windows\\r Multipoint Server 2012. Red Hat Enterprise Linux 7.0 and 6.5. SUSE Linux\\r Enterprise Server 11 SP3. VMware vSphere (ESXi) 5.1 P5 and 5.5 U2
BIOS type	UEFI
Chassis type	Rack (2U)
Power supply	550 W
Certification	80 PLUS Platinum
Operating altitude	0 - 3048 m
Storage temperature (T-T)	-10 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	8 - 90 %
Processor ARK ID	81897
Intel Secure Key Technology version	1.00
Intel Identity Protection Technology version	0.00

Weight and Dimensions

Depth	764 mm
Width	482 mm
Height	87 mm