Lenovo ThinkStation C20 - Page 37

Figure28.Removingtheheatsinkandfanassembly
8.Carefullylifttheheatsinkandfanassemblyoffthesystemboard.
Notes:
a.Y oumighthavetogentlytwisttheheatsinkandfanassemblytofreeitfromthemicroprocessor.
b.Donottouchthethermalgreasewhilehandlingtheheatsinkandfanassembly.
9.Removetheplasticcoverfromthebottomofthenewheatsinkandfanassemblytoexposethethermal
grease(thiscoverprotectsthethermalgreasefromcontamination).
Notes:
a.Donotremovetheplasticcoveruntilyouarereadytoinstalltheheatsinkandfanassemblyon
themicroprocessor.
b.Donottouchthethermalgreaseontheheatsinkandfanassembly.
c.Donotputtheheatsinkandfanassemblyanywhereexceptonthemicroprocessoraftertheplastic
coverhasbeenremovedandthethermalgreaseexposed.
10.Positionthenewheatsinkandfanassemblyonthemicroprocessorsothatthefourscrewsarealigned
withtheholesinthesystemboard.
Note:Positionthenewheatsinkandfanassemblysothattheheatsinkandfanassemblycableis
towardthemicroprocessorfanconnectoronthesystemboard.
11.Followthissequencetoinstallthefourscrewstosecurethenewheatsinkandfanassembly:
a.Partiallytightenscrew1,thenfullytightenscrew2,andthenfullytightenscrew1.
b.Partiallytightenscrew3,thenfullytightenscrew4,andthenfullytightenscrew3.
12.Connecttheheatsinkandfanassemblycabletothesystemboard.See“Locatingpartsandconnectors
onthesystemboard”onpage9.
13.Ifyouarereplacingheatsinkandfanassembly2,reinstalltheopticaldrivebracketintothechassis.
Then,reinstalltheopticaldriveintothechassis.See“Replacingtheopticaldrive”onpage27
.
Chapter2.Installingorreplacinghardware31