392 | Technical documentation
Electromagnetic compatibility (EMC, IEC 60601-1-2:2007, Table 2)
Electromagnetic immunity
Thopaz
+
is intended for use in the electromagnetic environment specified below.
The customer or the user of
Thopaz
+
should assure that they are used in such an
environment.
Immunity Tests
Electrostatic
Discharge (ESD)
IEC 61000-4-2
IEC 60601
test level
± 6 kV contact
± 8 kV air
Compliance
level
± 4 kV contact
± 8 kV air
Electromagnetic
environment – guidance
Floors should be wood, concrete or
ceramic tile. If floors are covered with
synthetic material, the relative humidity
should be at least 30 %.
Electrical fast
transient/burst
IEC 61000-4-4
± 2 kV
for power
supply lines
± 1 kV
for input /
output lines
± 2 kV
for power
supply lines
± 1 kV
for input /
output lines
Mains power quality should be that
of a typical commercial or hospital
environment.
Surge
IEC 61000-4-5
± 1 kV
differential mode
± 2 kV
line(s) to earth
± 1 kV
differential mode
± 2 kV
line(s) to earth
Mains power quality should be that
of a typical commercial or hospital
environment.
Voltage dips,
short interrup-
tions and voltage
variations on
power supply
input lines
IEC 61000-4-11
<5 % U
T
(>95 % dip in U
T
)
for 0.5 cycle
40 % U
T
(60 % dip in U
T
)
for 5 cycles
70 % U
T
(30 % dip in U
T
)
for 25 cycles
<5 % U
T
(>95 % dip in U
T
)
for 5 sec
<5 % U
T
(>95 % dip in U
T
)
for 0.5 cycle
40 % U
T
(60 % dip in U
T
)
for 5 cycles
70 % U
T
(30 % dip in U
T
)
for 25 cycles
<5 % U
T
(>95 % dip in U
T
)
for 5 sec
Mains power quality should be that
of a typical commercial or hospital
environment. If the user of
Thopaz
+
requires continued operation during
power mains interruptions, it is recom-
mended that
Thopaz
+
be powered
from an uninterruptible power supply
or a battery.
Power frequency
(50/60 Hz)
magnetic field
IEC 61000-4-8
3 A/m 30 A/m Power frequency magnetic fields
should be at levels of a typical
commercial or hospital environment.
NOTE U
T
is the a.c. mains voltage prior to application of the test level.
To Next Page
Loading...
