27
8575
8575
N/B Maintenance
N/B Maintenance
Features
Ability to wake from D3
hot
and D3
cold
Fully compatible with the Intel 430TX (Mobile Triton II) chipset
A 208-pin low-profile QFP (PDV) or 209-ball MICROSTAR BGA
TM
ball grid array (GHK) package
3.3-V core logic with universal PCI interfaces compatible with 3.3-V and 5-V PCI signaling environments
Mix-and-match 5-V/3.3-V 16-bit PC Cards and 3.3-V CardBus Cards
Single PC Card or CardBus slot with hot insertion and removal
Burst transfers to maximize data throughput on the PCI bus and the CardBus bus
Parallel PCI interrupts, parallel ISA IRQ and parallel PCI interrupts, serial ISA IRQ with parallel PCI
interrupts, and serial ISA IRQ and PCI interrupts
Serial EEPROM interface for loading subsystem ID and subsystem vendor ID
Pipelined architecture allows greater than 130M bps sustained throughput from CardBus-to-PCI and from
PCI-to-CardBus
Interface to parallel single-slot PC Card power interface switches like the TI
TM
TPS2211
Up to five general-purpose I/Os
Programmable output select for CLKRUN\
Five PCI memory windows and two I/O windows available to the 16-bit PC Card socket
Two I/O windows and two memory windows available to the CardBus socket
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