Technical Service Manual 9
ISA Series Power Amplifiers
Multi-pin components (ICs, etc.)
Removal
Removing a multi-pin SMT component is a delicate procedure. Ideally, you should use a soldering iron with an attachment that allows you
to heat all the pins simultaneously.
If such a soldering device is not available, use this procedure:
1 Use a soldering iron and solder braid to remove as much solder as possible from the pins of the component.
2 With fine tweezers, carefully try to lift each pin to see if it’s free. If it’s not, touch it with the tip of the soldering iron and if necessary,
use the solder braid to remove the remaining solder.
3 Repeat the process until all the pins are free and you can remove the component.
Insertion
1 With a soldering iron and appropriate solder, melt just enough solder onto one pad to create a small mound of solder. It is usually
easiest to use a pad that corresponds to one of the end or corner pins of the component.
2 Grasp the component with tweezers. Melt the small mound of solder with the iron and place the component in the correct orientation
upon its pads and gently press it flat against the circuit board, with the appropriate terminal of the component pressed into the
melted solder.
3 Hold the component in place and take the soldering iron away. Let the solder harden to tack the component in place.
4 Fully solder the other terminals of the component to their pads. Let the solder harden.
5 Fully solder the tacked terminal of the component to its pad.
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