5G Module Series
RG255C-GL_Mini_PCIe_Hardware_Design 52 / 57
7.3. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for
reference only. The appearance and structure of the packaging materials are subject to the actual
delivery.
The module adopts blister tray packaging and details are as follow:
7.3.1. Blister Tray
Dimension details are as follow:
Figure 25: Blister Tray Dimension Drawing
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