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General| Form Factor | LGA |
|---|---|
| Chipset | Qualcomm Snapdragon X55 |
| 5G NR Sub-6 GHz | Yes |
| LTE Category | Cat 20 |
| Operating Temperature | -40°C to +85°C |
| Storage Temperature | -40°C to +90°C |
| Cellular Technology | 5G NR, LTE, WCDMA |
| 5G NR Frequency Bands | n1, n3, n5, n7, n8, n20, n28, n77, n78, n79 |
| LTE Frequency Bands | B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B66 |
| WCDMA Bands | B1, B2, B4, B5, B8 |
| Interfaces | USB, UART, GPIO, I2C, SPI |
| Weight | 10g |
| GNSS | GPS, GLONASS, BeiDou, Galileo |
| Data Rates (5G) | UL: Up to 900Mbps |
| Data Rates (LTE) | Up to 2.0 Gbps |
| Certifications | CE, FCC, GCF, PTCRB |
| MIMO | 4x4 MIMO (LTE), 2x2 MIMO (5G NR) |
Precautions for driving, aircraft, medical equipment, RF interference, and explosive atmospheres.
Comprehensive pinout and detailed description of each pin's function.
Requirements, voltage drop management, and reference design for power supply.
Procedures and timing for powering on, off, and resetting the module.
Details of the USB 3.1/2.0 interface, including usage for firmware upgrade.
Pin definitions, mapping, operating frequencies, sensitivity, and output power.
ESD precautions, handling procedures, and thermal dissipation strategies.
Absolute maximum ratings, operating, and storage temperature limits.
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