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General| Module Type | AG525R-GL |
|---|---|
| Category | Control Unit |
| Manufacturer | Quectel |
| Module Size | LGA |
| Operating Temperature | -40°C to +85°C |
| Operating Voltage | 3.8V (Typical) |
| Cellular Technology | LTE |
| Technology | LTE |
| Frequency Bands | B1/B3/B5/B7/B8/B20 |
| Power Supply | 3.3V |
| Interface | USB 3.1 |
| GNSS | GPS, GLONASS, BeiDou, Galileo, QZSS |
| Certifications | CE, FCC |
Records changes made to the document over time, detailing versions and dates.
Essential safety precautions for operating and handling the cellular terminal or mobile device.
Overview of the AG525R-GL QuecOpen module's architecture and capabilities.
Detailed list of the module's technical specifications and functionalities.
Block diagram illustrating the major functional parts and internal structure of the module.
Introduces the module's 400 LGA pins and outlines the interfaces covered.
Visual representation of pin layout and numbering for top view of the module.
Detailed explanation of each pin's function, I/O type, and DC characteristics.
Methods and mechanisms for reducing the module's current consumption during operation.
Information on power supply requirements, pins, and reference designs for stable operation.
Procedures for turning the module on and off using PWRKEY, PON_1, and API.
Specifications and reference circuits for connecting (U)SIM cards to the module.
Details on USB 3.0 and 2.0 interfaces, including reference circuits for applications.
Description of UART1, BT UART, and Debug UART interfaces, including pin definitions.
Interfaces for WLAN (PCIe) and Bluetooth (UART/PCM) connectivity.
Defines the main and diversity antenna interfaces, pinout, and operating frequencies.
Requirements and recommendations for antenna installation, including connector types.
Specifies the extreme voltage and current limits for module pins.
Defines the operational, extended, and storage temperature ranges for the module.
Provides detailed current consumption values for various operating modes and conditions.
Specifies the RF output power levels across different frequency bands and technologies.
Details the sensitivity levels for receiving radio signals across various bands.
Outlines the module's susceptibility to ESD and required handling precautions.
Guidance on thermal management, heatsink design, and temperature limits for optimal performance.
Provides top and side views with dimensions and tolerances for module physical characteristics.
Recommended PCB footprint layout for module placement and soldering.
Visual representation of the module's top and bottom surfaces for identification.
Requirements for storing the module, including conditions, shelf life, and floor life.
Guidelines for solder paste application, stencil thickness, and reflow soldering thermal profiles.
Details about the module's packaging, including tape and reel specifications.
List of related documentation for further information on the module and its applications.
Glossary of terms and abbreviations used throughout the document for clarity.
Description of GPRS multi-slot modes, defining downlink, uplink, and active slots.
Details EDGE modulation types and coding schemes, including data rates per timeslot.
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