Quectel QuecOpen AG525R-GL

Automotive Module Series
AG525R-GL QuecOpen
Hardware Design
AG525R-GL_QuecOpen_Hardware_Design 21 / 104
3 Application Interfaces
3.1. General Description
The module is designed with 400 LGA pins that can be connected to cellular application platforms.
Module interfaces are described in detail in the following sub-chapters:
 Power supply
 (U)SIM interfaces
 USB 2.0/3.0 interface
 UART interfaces
 I2S and I2C interfaces
 SDIO interface
 SPI interfaces
 RGMII interface
 WLAN and BT interfaces*
 ADC interfaces
 USB_BOOT interface
 GPIO interfaces
“*” means under development.
NOTE