Automotive Module Series
AG525R-GL QuecOpen
Hardware Design
AG525R-GL_QuecOpen_Hardware_Design 90 / 104
Figure 38: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
1. For better performance, the maximum temperature of the internal BB chip should be kept below
105 °C. When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module
works normal but provides reduced performance (such as RF output power and data rate). When the
maximum BB chip temperature reaches or exceeds 118 °C, the module will disconnect from the
network, and it will recover to network connected state after the maximum temperature falls below
118 °C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB
chip temperature always maintains below 105 °C. Customers can execute AT+QTEMP command
and get the maximum BB chip temperature from the first returned value.
2. For more detailed introduction on thermal design, see document [5].
NOTES
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