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Quectel QuecOpen AG525R-GL

Quectel QuecOpen AG525R-GL
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Automotive Module Series
AG525R-GL QuecOpen
Hardware Design
AG525R-GL_QuecOpen_Hardware_Design 92 / 104
Figure 40: Module Bottom Dimensions (Top View)
The package warpage level of the module conforms to JEITA ED-7306 standard.
NOTE

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