5G Module Series
RM500Q-GL Hardware Design
RM500Q-GL_Hardware_Design 76 / 85
Table 43: (U)SIM 3.0V I/O Requirements
6.4. Electrostatic Discharge
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
Table 44: Electrostatic Discharge Characteristics (Temperature: 25 ºC , Humidity: 40 %)
6.5. Thermal Dissipation
RM500Q-GL is designed to work in an extended temperature range. To achieve a maximum performance
while working under extended temperatures or extreme conditions (such as with maximum power or data
rate) for a long time, it is strongly recommended to add a thermal pad or other thermally conductive
compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown below, and
thermal paste are also added on the BB, MCP, PMU, WTR, PA-1, PA-2 chips inside the module. The
dimensions are measured in mm.
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