5G Module Series
RM520N-GL_Hardware_Design 7 / 84
7.2. Top and Bottom Views .............................................................................................................. 76
7.3. M.2 Connector ........................................................................................................................... 76
7.4. Packaging ................................................................................................................................. 76
7.4.1. Blister Tray ..................................................................................................................... 76
7.4.2. Packaging Process ........................................................................................................ 78
8 Appendix A References ..................................................................................................................... 79
9 Appendix B Operating Frequency.................................................................................................... 82
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