Q150T Sample Preparation System
Q150T - Instruction Manual 45 10473 - Issue 5
6.2.2 Generic Sputter
This option allows you to change the default settings used during sputter coating
sequences. The Q150T uses these settings in all profiles of type: Timed Sputter and
FTM Terminated Sputter unless overridden in the profile (see page 83).
To change the settings, tap on Generic Sputter and then tap on the Edit button. The
Generic Sputter properties are displayed (see Figure 6-4 and Table 13).
Figure 6-4. Generic sputter parameters
Table 13 Generic Sputter parameters
Name Default
Value
Minimum
Value
Maximum
Value
Comment
Gas Bleed Time
(Seconds)*
15 0 20
Time Ar allowed to flow into
chamber before plasma started
Bleed Vacuum* 1x10
5x10
5x10
Pressure at which the chamber
is maintained at while the
plasma is present
Clean Current
(mA)*
150 100 150
Current at which the target is
cleaned at.
Clean Time
(Seconds)*
30 0 60
Time for which the target is
cleaned for
Clean Discharge
time (Seconds)*
20 15 90
Only used during pulse cleaning
of target. Time allowed for the
tagert to discharge after the
clean time
Max pulse clean
cycles*
2 25 15
Only used during pulse cleaning
of target. Specifes maximum
number of repeated pulse
cleaning cycles that can carried
out before the process is aborted
* Admin group level required to edit this property
1. To edit a parameter, tap on its value.
2. Change the value as required. The instrument displays a dialog box for editing
purposes, with either a numeric keypad or keyboard as required. The dialog box
also shows the allowed values for the parameter.
3. When you edit a value, click on the OK button to confirm the change or on the
Cancel button to restore the previous value.
4. Edit other parameters as required.
5. Back on the Generic Sputter page, click on the OK button to confirm the changes
or on the Cancel button to restore the previous values.
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