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Q150T S
Quorum Q150T S User Manual
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Q150T
Sample
Preparation
System
Q150T
-
Instruction
Manual
85
10473
-
Issue
5
9.4
Sputtering
Deposition
Rate
These
graphs
are
provided
for
guidance
only
and
are
not
to
be
taken
for
absolute
reference
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
10
20
30
40
50
60
70
80
Deposition
Current
(mA)
D
e
p
o
si
t
io
n
R
a
t
e
(
n
m
/
m
in
)
7*10-3
1*10-2
Figure
9-1.
Sputtering
Deposition
Rate
using
Gold
Gold
tooling
factor
=
2.7
84
86
Table of Contents
Default Chapter
3
Table of Contents
3
1 Introduction
8
General Description
8
Figure 1-1. Front View of the Q150T
8
Sputter Coating
9
Carbon Coating
9
Metal Evaporation
9
Aperture Cleaning
9
2 Installation
10
Pre-Installation
10
Required Services
10
Unpacking
11
Connections
12
Figure 2-1. Q150T Rear Panel
12
Figure 2-2. Gas Connectors with Filter (Part No. 12842) Fitted to Purge Gas Inlet
13
Gas Connections
13
Aux Network Connection
14
Electrical Connections
14
Figure 2-3. Power Outlet Lead Wiring
14
Vacuum Connections
15
Figure 2-4. Fitting the Standard Stage
16
Fitting the Standard Stage
16
Optional Connections
16
3 Operation
17
Switching on for the First Time
17
The Standby Screen
17
Figure 3-1. Standby Screen
17
Running a Profile
18
Figure 3-2. Selecting a Profile
18
Table 1 Q150T Default Profiles
18
Figure 3-3. a Run in Progress: with FTM Installed (Left) and Without FTM (Right)
19
Figure 3-4. Venting the Chamber: with FTM Installed (Left) and Without FTM (Right)
19
System Settings
20
Figure 3-5. Listing System Properties for a Profile
20
Figure 3-6. Changing the Stage Rotate System Property
20
4 Working with Profiles
21
Editing the Active Profile
21
Profile Editor
21
Figure 4-1. Profile Editor
21
Table 2 Profile Icons
22
Creating a New Profile
23
Figure 4-2. Creating a New Profile
23
Figure 4-3. Entering a New Profile Name
23
Editing Profile Parameters
24
Figure 4-4. Editing Profile Parameters
24
Materials
25
Figure 4-5. Materials Editor
25
Table 3 Materials and Their Density
25
Creating a New Material
26
Editing Material Parameters
26
Table 4 Material Parameters
26
Deleting a Material
27
Figure 4-6. Material Parameters
27
5 Application Guidelines
28
QT Timed Sputter
28
Tungsten SEM Work
28
High Resolution SEM Coatings for Field Emission SEM
28
Aluminium Thin Film
29
QT FTM Terminated Sputter
30
High Resolution SEM Coatings for Field Emission SEM
30
General Thin Film Coatings
30
Metal Evaporation
31
How to Achieve a 20Nm Gold Coating
31
Figure 5-1. QT Metal Evaporation Process
31
Pulsed Cord Evaporation
32
How to Create a 20Nm Carbon Coating
32
5.5 Controlled Pulse Cord Evaporation
32
Using Controlled Pulse to Create a 15Nm Coat or 2-3Nm for EBSD
32
Table 5 QT Pulsed Cord Evaporation Parameters for 20Nm Coating
32
Table 6 QT Controlled Pulsed Cord Evaporation Parameters for 25Nm Coating
32
Figure 5-2. Typical 12Nm Controlled Pulse Evaporation
33
Pulsed Rod Evaporation
34
How to Create a Conductive Layer for SEM
34
Table 7 QT Pulsed Rod Evaporation Parameters for Conductive Layer for SEM
34
Ramped Profile
35
Carbon Insert Setup
35
Figure 5-3. Wedge Tool (Part No. 12097)
35
Figure 5-4. (L) a Finished Wedge-Shaped Rod; and (R) in Position with Plain Rod
35
The Ramped Current Profile
36
Figure 5-5. Ramped Profile with Default Parameters
36
Adjusting Coating Thickness
37
How to Create a Carbon Support Layer for TEM
37
Table 8 QT Ramped Carbon TEM Parameters for 5Nm Coating
37
How to Create a Conductive Carbon Layer for SEM
38
Table 9 QT Ramped Carbon Parameters for SEM Coatings
38
Using Outgas Source Options
39
Setting Outgas Source Options
39
Running Multiple Outgassing
39
Figure 5-6. Prompts to Repeat the Outgas Procedure (Left) and Proceed with Coating (Right)
39
Table 10 Outgas Source Options
39
Glow Discharge
40
Hydrophilisation
40
Surface Cleaning
40
Table 11 Glow Discharge Treatments
40
Aperture Cleaning
41
Figure 5-7. Aperture Cleaning in Progress
41
6 Instrument Management
42
The Q150T Menus
42
Table 12 Q150T Menus
42
Instrument Settings
43
Figure 6-1. System Editor
43
Figure 6-2. Network Properties
44
Figure 6-3. Active Ftp Address
44
Network
44
Figure 6-4. Generic Sputter Parameters
45
Generic Sputter
45
Table 13 Generic Sputter Parameters
45
Figure 6-5. Vacuum Parameters
46
Table 14 Vacuum Parameters
46
Vacuum
46
Figure 6-6. Maintenance Settings
47
Maintenance
47
Table 15 Maintenance Settings
47
Figure 6-7. Hardware Settings (Single Target)
48
Hardware
48
Table 16 Hardware Settings
48
User Management
49
Changing User Group
49
Figure 6-8. Changing the User Level
49
Managing User Groups
50
Figure 6-9. Managing User Groups
50
Film Thickness Monitor
51
Setting the Date and Time
51
Figure 6-10. FTM Status
51
Figure 6-11. Setting the Date and Time
51
Setting up a Network Connection
52
Configuring a Firewall Exception for Windows Explorer
52
Connecting the Q150
52
Figure 6-12. Connecting the Q150 to a Network
52
Network Troubleshooting
53
Process Logging
53
Figure 6-13. Process Log and Browse Buttons
53
Figure 6-14. Process Log Detail
53
7 Accessories
54
Sputter Insert
54
Figure 7-1. Top View of the Sputter Insert
54
Figure 7-2. Sputter Insert and Target Assembly
55
Carbon Rod Insert
56
Figure 7-3. Carbon Rod Insert
56
Figure 7-4. Recommended Carbon Rod Shapes
57
Figure 7-5. Carbon Rod Shaper (S8650/S8651))
57
Shaping Carbon Rods for Pulsed Evaporation
57
Shaping Carbon Rods for Ramped Evaporation
58
Fitting the Carbon Fibre Insert
58
Figure 7-6. Carbon String Insert
58
Metal Evaporation Insert
59
Installing a Wire Basket
59
Installing a Molybdenum Boat for Aperture Cleaning
59
Figure 7-7. Fitting the Metal Evaporation Insert for Downwards Evaporation
59
Adapting the Insert for Upwards Evaporation
60
Figure 7-8. Metal Evaporation Insert Adapted for Upwards Evaporation
61
Glow Discharge Insert
62
Figure 7-9. Glow Discharge Insert
62
Figure 7-10. Removing the Shutter
63
Rotacota Stage
64
Figure 7-11. Rotacota Stage
64
Slide Stage
65
Figure 7-12. Slide Stage
65
102Mm Stage and Gearbox
66
Figure 7-13. Large (102Mm) Sample Stage and Gearbox
66
Tilt Stage
67
Figure 7-14. Adjustable Tilting Stage
67
Film Thickness Monitor (FTM)
68
Replacing the FTM Crystal
68
Figure 7-15. FTM (Left); Replacing the FTM Crystal (Centre); FTM Lead (Right)
68
Extended Height Cylinder
69
Full Range Vacuum Gauge Assembly
69
Figure 7-16. the Extended Height Cylinder in Position
69
Rotating Vacuum Spigot
70
Figure 7-17. Rotating Vacuum Spigot
70
Emergency Stop Module
71
Figure 7-18. the Emergency Stop Module
71
Figure 7-19. Connecting the Emergency Stop Module
71
Spares
72
Table 17 Spare Parts for the Q150T
72
Table 18 Replacement Targets for Q150T S and Q150T es
72
Other Accessories
73
Table 19 Accessories for the Q150T
73
8 Service and Maintenance
74
Maintenance
74
Table 20 Maintenance Tasks
74
Troubleshooting
75
Error Messages
75
Table 21 Error Messages
75
Table 22 Warning Messages
77
Table 23 Information Messages
77
9 Appendices
78
Profile Parameters
78
Table 24 Ftm/Timed Sputter Coating Parameters
78
Table 25 Carbon Pulse/Rod Evaporation Profile Parameters
79
Table 26 Controlled Pulse Cord
80
Table 27 Ramped Profile Parameters
81
Table 28 Metal Evaporation Profile Parameters
82
System Overrideable Parameters
83
Table 29 Aperture Cleaning Profile Parameters
83
Table 30 Vacuum Shutdown Properties
83
Table 31 System Override Properties
83
Technical Specification
84
Table 32 Technical Specification
84
Sputtering Deposition Rate
85
Figure 9-1. Sputtering Deposition Rate Using Gold
85
Figure 9-2. Sputtering Deposition Rate Using Chromium
86
Figure 9-3. Sputtering Deposition Rate Using Silver
87
Return of Goods
88
General Introduction
88
Health and Safety Declaration
88
Despatch
88
Return Address
88
Declaration of Contamination Form
89
Table 33 Declaration of Contamination Form
89
10 Index
90
4
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Quorum Q150T S Specifications
General
Brand
Quorum
Model
Q150T S
Category
Laboratory Equipment
Language
English
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