Sony HCD-DZ830W - Page 35

3535
HCD-DZ830W/DZ850KW
HCD-DZ830W/DZ850KW
• Circuit Boards Location
(DZ830W)
(DZ850KW)
IO-S-OUT board
DMPORT board
(EXCEPT E32, MX)
FL board
JACK board
P-SW board
IO-SCART board
DMPORT board
DIAT-TX board
SPEAKER board
MAIN board
HEATSINK B board
INSULATOR board
SUPPORT board
HEATSINK A board
TUNER (FM/AM)
POWER board
DSP board
DSP board
MS-203 board
FL board
JACK board
P-SW board
DIAT-TX board
SPEAKER board
MAIN board
HEATSINK B board
INSULATOR board
SUPPORT board
HEATSINK A board
TUNER (FM/AM)
POWER board
MS-203 board
•Waveforms
– MAIN Board –
– IO-SCART Board – (DZ830W)
2 IC1101 <xcv (XTALI)
1 V/DIV, 10 ns/DIV
37 ns
3.3 Vp-p
1 IC1101 6 (DVDRFIP)
200 mV/DIV, 100 ns/DIV
900 mVp-p
3 IC1101 <z,m (CVBS)
500 mV/DIV, 20 µ s/DIV
H
1.5 Vp-p
5.0 Vp-p
20.3 ns
5 IC3010 rk (XFSOIN)
1 V/DIV, 10 ns/DIV
4 IC501 qg (XIN)
1 V/DIV, 100 ns/DIV
200 ns
3.0 Vp-p
4 IC230 wf (CYOUTa)
5 IC230 wa (CbOUTa)
6 IC230 qk (CrOUTa)
1 IC201 wf (CYOUTa)
2 IC201 wa (CbOUTa)
3 IC201 qk (CrOUTa)
500 mV/DIV, 20 µ s/DIV
H
1.7 Vp-p
500 mV/DIV, 20 µ s/DIV
1.7 Vp-p
H
500 mV/DIV, 20 µ s/DIV
1.7 Vp-p
H
1 V/DIV, 20 µ s/DIV
2 Vp-p
H
1.8 Vp-p
H
500 mV/DIV, 20 µ s/DIV
500 mV/DIV, 20 µ s/DIV
H
1.5 Vp-p
– IO-S-OUT Board – (DZ850KW)
1 IC308 wh (C OUT)
2 IC308 wa (Y OUT)
3 IC308 w; (CY OUT)
4 IC308 qk (Cb OUT)
5 IC308 qh (Cr OUT)
1 V/DIV, 20 µ s/DIV
H
1.3 Vp-p
1 V/DIV, 20 µ s/DIV
2 Vp-p
H
1 V/DIV, 20 µ s/DIV
2 Vp-p
H
1.8 Vp-p
H
500 mV/DIV, 20 µ s/DIV
500 mV/DIV, 20 µ s/DIV
H
1.5 Vp-p
– DSP Board –
1 IC1804 tj (OSC1)
40.6 ns
2.3 Vp-p
500 mV/DIV, 20 ns/DIV
– DIAT-TX Board –
1 IC002 <zvx (CLKIN)
40 ns
1.9 Vp-p
1 V/DIV, 20 ns/DIV
Ver. 1.1
w w w . x i a o y u 1 6 3 . c o m
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6 3
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0 9 9
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8 9
4 2
9 8
T E L 1 3 9 4 2 2 9 6 5 1 3 9 9 2 8 9 4 2 9 8 0 5 1 5 1 3 6 7 3
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