Sony UP-D897 - 1-5. Procedure Required for Replacement; 1-6. Unleaded Solder

1-5. Procedure Required for Replacement
When
replacing
the
following
parts,
perform
each
required
process
according
to
the
table
below.
For
the
procedure
before
and
after
performing
the
required
process,
refer
to
Section
2-1.
Parts
Required
process
Reference
MA-132
board
Firmware
Version
Upgrade
Section
2-5
IC103
(MA-132
board)
KY-572
board
Calibration
and
Electrical
Conductivity
Check
Section
2-2
Switching
regulator
Head
Voltage
Adjustment
Section
2-3
Thermal head
eee
1-6. Unleaded Solder
Boards
requiring
use
of
unleaded
solder
are
printed
with
a
lead
free
mark
(LF)
indicating
the
solder
contains
no
lead.
(Caution:
Some
printed
circuit
boards
may
not
come
printed
with
the
lead
free
mark
due
to
their
particular
size.)
/3B) . LEAD FREE MARK
*
Be
sure
to
use
the
unleaded
solder
for
the
printed
circuit
board
printed
with
the
lead
free
mark.
*
The
unleaded
solder
melts
at
a
temperature
about
40
°C
higher
than
the
ordinary
solder,
therefore,
it
is
recommended
to
use
the
soldering
iron
having
a
temperature
regulator.
*
The
ordinary
soldering
iron
can
be
used
but
the
iron
tip
has
to
be
applied
to
the
solder
joint
for
a
slightly
longer
time.
The
printed
pattern
(copper
foil)
may
peel
away
if
the
heated
tip
is
applied
for
too
long,
so
be
careful.
UP-D897
1-9