AN2586 Rev 8 21/29
Recommendations
28
6 Recommendations
6.1 Printed circuit board
For technical reasons, it is best to use a multilayer printed circuit board (PCB) with a
separate layer dedicated to ground (V
SS
) and another dedicated to the V
DD
supply. This
provides good decoupling and a good shielding effect. For many applications, economical
reasons prohibit the use of this type of board. In this case, the major requirement is to
ensure a good structure for ground and for the power supply.
6.2 Component position
A preliminary layout of the PCB must separate the different circuits according to their EMI
contribution in order to reduce cross-coupling on the PCB, that is noisy, high-current circuits,
low-voltage circuits, and digital components.
6.3 Ground and power supply (V
SS
, V
DD
)
Every block (noisy, low-level sensitive, digital, etc.) must be grounded individually, and all
ground returns must be to a single point. Loops must be avoided or have a minimum area.
The power supply must be implemented close to the ground line to minimize the area of the
supply loop. This is due to the fact that the supply loop acts as an antenna, and is therefore
the main transmitter and receiver of EMI. All component-free PCB areas must be filled with
additional grounding to create a kind of shielding (especially when using single-layer PCBs).
6.4 Decoupling
All power supply and ground pins must be properly connected to the power supplies. These
connections, including pads, tracks and vias must have as low an impedance as possible.
This is typically achieved with thick track widths and, preferably, the use of dedicated power
supply planes in multilayer PCBs.
In addition, each power supply pair must be decoupled with filtering ceramic capacitors C
(100 nF) and a chemical capacitor C of about 10 µF connected in parallel on the
STM32F10xxx device. These capacitors need to be placed as close as possible to, or
below, the appropriate pins on the underside of the PCB. Typical values are 10 nF to 100 nF,
but exact values depend on the application needs. Figure 13 shows the typical layout of
such a V
DD
/V
SS
pair.
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