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Brand | ST |
---|---|
Model | STM32F7 Series |
Category | Microcontrollers |
Language | English |
Application note for STM32F7 Series MCU hardware development overview.
Lists related application notes available on www.st.com.
Overview of the device's power requirements and supply pins.
Details on the separate power supply for the ADC for improved accuracy.
Requirements for the VDDUSB supply for USB transceivers.
Dedicated power supply for SDMMC2 peripherals.
Power supply for the DSI/MIPI DPHY subsystem.
Supply for RTC, backup registers, and SRAM when VDD is off.
Describes the internal voltage regulator modes and operation.
Integrated circuitry for power-on and power-down reset.
Monitors VDD against a programmable threshold.
Describes events that trigger a system reset.
Configuration for internal reset functionality based on PDR_ON pin.
Details operation when the internal voltage regulator is disabled.
Table summarizing regulator and reset ON/OFF states per package.
Demonstrates using STM32CubeMX for pin mapping exploration.
Configuration of the High-Speed External (HSE) oscillator.
Configuration of the Low-Speed External (LSE) oscillator.
Monitors HSE clock for failures and switches to HSI.
Selection of boot mode using BOOT pin and option bytes.
Using the embedded bootloader for Flash reprogramming.
Overview of host/target interface for debugging.
Description of the Serial Wire/JTAG Debug Port (SWJ-DP).
Specific pins used for SWJ-DP functions.
Options for disabling SWJ-DP ports and releasing pins.
How internal pull-ups/downs are managed for JTAG pins.
Shows the connection of SWJ-DP to a standard JTAG connector.
Recommendations for multilayer PCB design for decoupling and shielding.
Guidance on component placement for EMI reduction.
Best practices for grounding and power supply implementation.
Proper connection and placement of decoupling capacitors.
Recommendations for unused MCU resources for EMC improvement.
Specific recommendations for the WLCSP180 package.
Description of the reference design based on STM32F756NGH6.
Lists mandatory and optional components for the reference design.
Examples of 4 and 6-layer PCB stack-ups for impedance matching.
Guidance on layout and routing for crystal oscillator circuits.
Techniques for adequate power decoupling to prevent noise.
Connectivity and signal layout for the SDMMC bus interface.
Connectivity and signal layout for the FMC controller.
Connectivity and signal layout for the Quad-SPI interface.
Interface connectivity and signal layout for ETM.
Design parameters and fan-out examples for BGA 216 package.
Design parameters and layout example for WLCSP143 package.