DocID027559 Rev 5 37/54
AN4661 Reference design
53
7.2 Component references
Table 6. Mandatory components
Id Component name Reference Quantity Comments
1 Microcontroller STM32F756NGH6 1 TFBGA216 package
2 Capacitor 100 nF 19
Ceramic capacitors
(decoupling capacitors)
3 Capacitor 4.7 µF 1
Ceramic capacitor
(decoupling capacitor)
Table 7. Optional components
Id
Components
name
Reference Quantity Comments
1 Resistor 10 k 6
Pull-up and pull-down for JTAG, BOOT pin, PDR and
bypass regulator
2 Resistor 0
2
– Used as star connection point between V
DDA
and
V
REF+
– Used as star connection point between V
DD_MCU
and V
DDUSB
3 Capacitor 100 nF 5 Ceramic capacitor.
4 Capacitor 1.5 pF 2
Used for LSE: the value depends on the crystal
characteristics.
5 Capacitor 1 F 3 Used for V
DDA
and V
REF
and V
DDUSB
.
6 Capacitor 2.2 F 2 Used for internal regulator when it is on.
7 Capacitor 20 pF 2
Used for HSE: the value depends on the crystal
characteristics.
8 Quartz 25 MHz 1 Used for HSE.
9 Quartz 32.768 kHz 1 Used for LSE.
10
JTAG
connector
HE10-20 1 -
11 Battery 3V 1
If no external battery is used in the application, it is
recommended to connect V
BAT
externally to V
DD
.
12 Switch SPDT 1 Used to select the right boot mode.
13 Push-button B1 1 Reset button
14 Jumper 3 pins 2 Used to select V
BAT
source, and BYPASS_REG pin.
15 Ferrite bead
FCM1608KF
-601T03
1 Additional decoupling for V
DDA
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