Appendix C: System Specications
143
Appendix C
System Specications
Processors
Dual Intel Xeon 8100/6100/5100/4100/3100 processors in a P (LGA 3647) socket
UPI up to 10.4GT/s; support CPU TDP 70-205W
Chipset
Intel C621
BIOS
AMI 32Mb SPI Flash ROM
Memory
Capacity: 24 DIMM slots; up to 3 TB 3DS LRDIMM or RDIMM
Type: 2666/2400/2133MHz ECC DDR4 SDRAM
Drive Bays
Twelve hot-swap 3.5" bays for twelve SATA drives, with an option for up to 12 SAS3, or 4 NVMe
PCI Expansion Slots
Two full height, double width, PCIe slots (one x8, one x16), four full height, full width x8 PCIe slots, one low
Input/Output (per node)
Network: Two to four LAN ports, varies by model
IPMI: Dedicated LAN port
USB 3.0: Two ports on the rear I/O panel (USB 0/1)
One serial port; one VGA port
DOM: Two SuperDOM (Disk on Module) port
Motherboard
X11DPU; Length 17.0", width 16.8" (431.8 mm x 426.7 mm)
Chassis
SC829U2AC4-R1K02-T; 2U Rackmount, (WxHxD) 17.2 x 3.5 x 28.5 in. (437 x 89 x 723 mm)
System Cooling
Power Supply
Model: PWS-1K02A-1R, 800/1000 W redundant modules, 80Plus Titanium level
Input:
100-127Vac / 9.8–7 A / 50-60 Hz
200-240Vac / 7–5 A / 50-60 Hz
+12V:
Max: 66.7 A / Min: 0 A (100-127 Vac)
Max: 83 A / Min: 0 A (200-240 Vac)
+12 V standby: Max: 2.1 A / Min: 0 A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
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