Texas Instruments LMK0482 Series - Page 110

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PACKAGE OUTLINE
C
64X
0.3
0.2
7.2 0.1
60X 0.5
64X
0.5
0.3
0.8 MAX
4X
7.5
A
9.1
8.9
B
9.1
8.9
0.3
0.2
0.5
0.3
(0.1)
TYP
4214996/A 08/2013
WQFN - 0.8 mm max heightNKD0064A
WQFN
PIN 1 INDEX AREA
SEATING PLANE
1
16
33
48
17
32
64
49
(OPTIONAL)
PIN 1 ID
SEE TERMINAL
DETAIL
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
0.1 C A B
0.05 C
SCALE 1.600
DETAIL
OPTIONAL TERMINAL
TYPICAL