Texas Instruments LMK0482 Series - Page 111

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EXAMPLE BOARD LAYOUT
( 7.2)
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
64X (0.6)
64X (0.25)
(8.8)
(8.8)
60X (0.5)
(
) VIA
TYP
0.2
(1.36)
TYP
8X (1.31)
(1.36) TYP 8X (1.31)
4214996/A 08/2013
WQFN - 0.8 mm max heightNKD0064A
WQFN
SYMM
SEE DETAILS
1
16
17
32
33
48
49
64
SYMM
LAND PATTERN EXAMPLE
SCALE:8X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note
in literature No. SLUA271 (www.ti.com/lit/slua271).
SOLDER MASK
OPENING
METAL
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)