Toradex Apalis Series - User Manual

Apalis Computer Module
Carrier Board Design Guide

Toradex Apalis Series Specifications

General

Processor Options	NXP i.MX 8, i.MX 8X, NXP i.MX 6
GPU	Vivante GC7000Lite
Flash Memory	Up to 64GB eMMC
Storage	eMMC, SD card
Ethernet	1x Gigabit Ethernet
Wi-Fi	802.11 a/b/g/n/ac (Optional)
Bluetooth	Bluetooth 5.0/4.2 (Optional)
USB	USB 2.0, USB 3.0
Video Output	HDMI, LVDS, DisplayPort
Operating Systems	Linux, Android
Temperature Range	-40°C to +85°C
Expansion	PCIe, I2C, SPI, GPIO
Dimensions	82mm x 45mm

Summary

1 Introduction

1.1 Overview

General overview of the Apalis Carrier Board Design Guide and its purpose.

1.2 Additional Documents

Lists related documents and resources for carrier board design.

1.3 Abbreviations

Defines technical abbreviations used throughout the document.

2 Interfaces

2.1 Architecture

Explains the Apalis module architecture and types of interfaces.

2.2 PCI Express

Details the PCI Express interface, signals, and reference schematics.

2.3 SATA

Details the SATA interface, signals, and reference schematics.

2.4 Ethernet

Details the Ethernet interface, signals, and reference schematics.

2.5 USB

Details the USB interfaces, signals, and reference schematics.

2.6 Parallel RGB LCD Interface

Details the Parallel RGB LCD interface, signals, and schematics.

2.7 LVDS LCD Interface

Details the LVDS LCD interface, signals, and color mapping.

2.8 HDMI;DVI

Details the HDMI/DVI interface, signals, and reference schematics.

2.9 Analogue VGA

Details the analogue VGA interface, signals, and reference schematics.

2.13 SD;MMC;SDIO

Details the SD/MMC/SDIO interfaces, signals, and schematics.

2.14 I2 C

Details the I2C interfaces, signals, and termination recommendations.

2.15 UART

Details the UART interfaces, signals, and reference schematics.

2.16 SPI

Details the SPI interfaces, signals, and modes.

2.17 CAN

Details the CAN interface, signals, and reference schematics.

2.18 PWM

Details the PWM outputs, signals, and reference schematics.

2.19 Analogue Audio

Details the analogue audio interface, signals, and schematics.

2.20 Digital Audio

Details the digital audio interface, signals, and schematics.

2.21 S;PDIF (Sony-Philips Digital Interface I;O)

Details the S/PDIF interface, signals, and schematics.

2.22 Touch Panel Interface

Details the touch panel interface, signals, and schematics.

2.23 Analogue Inputs

Details the analogue input channels and signals.

2.24 Clock Output

Details the clock output signals and considerations.

2.25 GPIO

Details the dedicated GPIO pins and their usage.

2.26 Module Recovery

Explains the procedure for module recovery.

3 Power Management

3.1 Power Signals

Details digital, analogue, and power management supply signals.

3.2 Power Block Diagram

Illustrates the system's power block diagram.

3.3 Power States

Describes the available Apalis module power states.

3.4 Power Sequences

Explains the power-up and shutdown sequences.

3.5 Reference Schematics

Provides reference schematics for power supply circuits.

4 Mechanical and Thermal Consideration

4.1 Module Connector

Discusses MXM3 connector options and stacking height requirements.

4.2 Fixation of the Module

Explains methods for fixing the module to the carrier board.

4.3 Thermal Solution

Details heatsink options and thermal management considerations.

4.4 Module Size

Provides the physical dimensions of the Apalis module.

4.5 Connector and MXM SnapLock Land Pattern Requirements

Specifies land patterns for connectors and standoffs.

4.6 Carrier Board Space Requirements

Outlines required PCB area and component space considerations.

5 Appendix A - Physical Pin Definition and Location