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General overview of the Verdin Carrier Board Design Guide.
Lists related documents for carrier board design.
Glossary of abbreviations used in the document.
Describes the Verdin module's interface architecture.
Details standard interfaces present on all Verdin modules.
Explains interfaces reserved for additional functionality.
Covers interfaces specific to certain module variants.
Describes the pin numbering scheme for Verdin modules.
Details the PCI Express interface and its signals.
Covers the Ethernet interfaces available on Verdin modules.
Explains the USB interfaces and their capabilities.
Describes the HDMI and DVI interfaces for video output.
Details the MIPI DSI interface for displays.
Explains the MIPI CSI-2 interface for cameras.
Covers the SD/MMC/SDIO interface for storage devices.
Describes the I2C interfaces available on Verdin modules.
Details the UART interfaces for serial communication.
Explains the SPI interface for serial communication.
Covers the Quad SPI interface for high-speed flash memory.
Details the Controller Area Network (CAN) interface.
Explains the Pulse Width Modulation (PWM) outputs.
Describes the Inter-IC Sound (I2S) interfaces for audio.
Covers the analog input channels for sensors.
Details the general purpose clock output signals.
Explains the General Purpose Input/Output pins.
Covers the JTAG interface for debugging.
Details the module recovery process.
Describes power supply signals for the Verdin module.
Details the different power states of the Verdin module.
Describes power-up and power-down sequences.
Explores different power supply approaches.
Discusses backfeeding issues and prevention.
Details connector options and stacking heights.
Methods for securing the Verdin module.
Information on thermal management solutions.
Provides physical dimensions of the Verdin module.
Land pattern requirements for connectors and standoffs.
PCB area requirements for the carrier board.
Pin definitions for JTAG, PWM, DSI, and HDMI signals.
Pin definitions for CSI, UART, USB, RGMII, Ethernet, PCIe.
Pin definitions for system control and power signals.
Pin definitions for ADC, I2C, PWM, CAN, I2S, QSPI, SDIO.
Pin definitions for module-specific signals (bottom side).
Physical pin mapping for various signal groups.
General overview of the Verdin Carrier Board Design Guide.
Lists related documents for carrier board design.
Glossary of abbreviations used in the document.
Describes the Verdin module's interface architecture.
Details standard interfaces present on all Verdin modules.
Explains interfaces reserved for additional functionality.
Covers interfaces specific to certain module variants.
Describes the pin numbering scheme for Verdin modules.
Details the PCI Express interface and its signals.
Covers the Ethernet interfaces available on Verdin modules.
Explains the USB interfaces and their capabilities.
Describes the HDMI and DVI interfaces for video output.
Details the MIPI DSI interface for displays.
Explains the MIPI CSI-2 interface for cameras.
Covers the SD/MMC/SDIO interface for storage devices.
Describes the I2C interfaces available on Verdin modules.
Details the UART interfaces for serial communication.
Explains the SPI interface for serial communication.
Covers the Quad SPI interface for high-speed flash memory.
Details the Controller Area Network (CAN) interface.
Explains the Pulse Width Modulation (PWM) outputs.
Describes the Inter-IC Sound (I2S) interfaces for audio.
Covers the analog input channels for sensors.
Details the general purpose clock output signals.
Explains the General Purpose Input/Output pins.
Covers the JTAG interface for debugging.
Details the module recovery process.
Describes power supply signals for the Verdin module.
Details the different power states of the Verdin module.
Describes power-up and power-down sequences.
Explores different power supply approaches.
Discusses backfeeding issues and prevention.
Details connector options and stacking heights.
Methods for securing the Verdin module.
Information on thermal management solutions.
Provides physical dimensions of the Verdin module.
Land pattern requirements for connectors and standoffs.
PCB area requirements for the carrier board.
Pin definitions for JTAG, PWM, DSI, and HDMI signals.
Pin definitions for CSI, UART, USB, RGMII, Ethernet, PCIe.
Pin definitions for system control and power signals.
Pin definitions for ADC, I2C, PWM, CAN, I2S, QSPI, SDIO.
Pin definitions for module-specific signals (bottom side).
Physical pin mapping for various signal groups.
General| RAM | Up to 4 GB LPDDR4 |
|---|---|
| Serial | UART, SPI, I2C |
| Processor Options | NXP i.MX 8M Mini, NXP i.MX 8M Plus |
| CPU Cores | Up to 4x Arm Cortex-A53 (i.MX 8M Mini/Nano), Up to 4x Arm Cortex-A53 + 1x Cortex-M7 (i.MX 8M Plus) |
| CPU Speed | Up to 1.8 GHz (i.MX 8M Mini/Plus), Up to 1.5 GHz (i.MX 8M Nano) |
| GPU | Vivante GC7000UL (i.MX 8M Plus) |
| Storage | eMMC, SD card |
| Connectivity | Wi-Fi, Bluetooth |
| USB Ports | USB 2.0 |
| Display | MIPI-DSI, HDMI |
| Camera | MIPI-CSI |
| Audio | I2S |
| Operating Temperature | -40°C to 85°C (Industrial Grade) |
| Operating System | Linux |
| Security | Secure Boot |
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