Toradex Apalis Series - 4.6 Carrier Board Space Requirements

Apalis Carrier Board Design Guide
Toradex AG l Altsagenstrasse 5 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l info@toradex.com
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Figure 75: Module connector land pattern (dimensions in mm)
4.6 Carrier Board Space Requirements
The required PCB area for the module depends on the module fixing method and the cooling
solution. The following picture shows the maximum required area if the SnapLock is used in
combination with the suitable Toradex heat sink. Custom heat sink solutions might need additional
space on the carrier board.
Figure 76: Maximum carrier board space requirement (dimensions in mm)
If a system does not need a cooling solution and the module is fixed by screwing it down, the
required carrier board area becomes smaller.
2.95
3.30
5
0.50
37
1.50
1
.
6
0
1
.
1
0
82
Pin1Pin23
Pin2Pin24
Pin173
Pin164Pin174
Pin321
Pin320
Pin165
Pin17
Pin18
Module Insertion Edge
59
82
10
R
4
51
75
4
29
12.20
4.60
62.50