3.5 Reference Schematics ....................................................................................................... 69
4 Mechanical and Thermal Consideration ............................................................................... 71
4.1 Module Connector.............................................................................................................. 71
4.2 Fixation of the Module ........................................................................................................ 71
4.3 Thermal Solution ................................................................................................................ 73
4.4 Module Size ...................................................................................................................... 74
4.5 Connector and MXM SnapLock Land Pattern Requirements ................................................. 75
4.6 Carrier Board Space Requirements ..................................................................................... 76
5 Appendix A – Physical Pin Definition and Location ............................................................... 79
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