5
Declaraon of RoHS2 Compliance
This product has been designed and manufactured in compliance with Direcve
2011/65/EU of the European Parliament and the Council on restricon of the use of
certain hazardous substances in electrical and electronic equipment (RoHS2
Direcve), and is deemed to comply with the maximum concentraon values issued
by the European Technical Adaptaon Commiee (TAC) as shown below:
Substance
Proposed Maximum
Concentraon
Actual
Concentraon
Lead (Pb) 0.1% < 0.1%
Mercury (Hg) 0.1% < 0.1%
Cadmium (Cd) 0.01% < 0.01%
Hexavalent Chromium (Cr6+) 0.1% < 0.1%
Polybrominated biphenyls (PBB) 0.1% < 0.1%
Polybrominated diphenyl ethers (PBDE) 0.1% < 0.1%
Bis (2-ethylhexyl) phthalate (DEHP) 0.1% < 0.1%
Butyl benzyl phthalate (BBP) 0.1% < 0.1%
Dibutyl phthalate (DBP) 0.1% < 0.1%
Diisobutyl phthalate (DIBP) 0.1% < 0.1%
Certain components of products as stated above are exempted under the Annex III
of the RoHS2 Direcves as noted below:
Examples of exempted components are:
1. Mercury in cold cathode uorescent lamps and external electrode uorescent
lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):
(1) Short length (≦500 mm): maximum 3.5 mg per lamp.
(2) Medium length (＞500 mm and ≦1,500 mm): maximum 5 mg per lamp.
(3) Long length (＞1,500 mm): maximum 13 mg per lamp.
2. Lead in glass of cathode ray tubes.
3. Lead in glass of uorescent tubes not exceeding 0.2% by weight.
4. Lead as an alloying element in aluminum containing up to 0.4% lead by weight.
5. Copper alloy containing up to 4% lead by weight.
6. Lead in high melng temperature type solders (i.e. lead-based alloys containing
85% by weight or more lead).
7. Electrical and electronic components containing lead in a glass or ceramic other
than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound.
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