EasyManua.ls Logo

YASKAWA GPD 505/P5 - Power Component Maintenance and Specifications; Power Component Replacement Procedures

YASKAWA GPD 505/P5
67 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
PP.P5G5.03.Troubleshoot
Page 47
Rev. 06/11/2003
Power Component Replacement
POWER BOARD
AIR GAP
7MBR30NF060
POWER MODULE
HEAT SINK
Incorrect Method for Replacement of Circuit Board Mounted Components
Large board-mounted components (input diodes, output IGBT’s, and power
modules) are not being correctly installed into small size inverters during repair.
The components are being soldered to the power board, before being mounted to
the heat sink.

Table of Contents

Related product manuals