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Product Type | Electromagnetic Flowmeter |
---|---|
Model | FEP630 |
Process connection | Flange, wafer |
Electrode material | Stainless Steel, Hastelloy, Tantalum, Platinum-Iridium |
Liner material | PTFE, PFA, Hard Rubber |
Accuracy | ±0.2% of rate |
Repeatability | ±0.1% of rate |
Fluid temperature | -40°C to +180°C |
Process Temperature Range | -40°C to +180°C |
Ambient temperature | -40°C to +60°C |
Pressure rating | Up to PN 40 |
Housing material | Aluminum, Stainless Steel |
Protection class | IP67, IP68 |
Output signal | 4-20 mA, HART, PROFIBUS PA |
Power supply | 100-240 V AC, 24 V DC |
Ingress Protection | IP67, IP68 |
Certifications | ATEX, IECEx, FM, CSA, SIL |
Line Size Range | DN3 to 2000 (1/10 to 80 in.) |
General guidelines, intended use, improper use, and safety warnings.
Details warnings, potentially explosive atmospheres, and data safety considerations.
Explanation of device identification plates and additional warning labels.
Contact information for ABB offices relevant to the product.
Guidelines for inspecting, transporting, and storing the device safely.
Procedures for returning the device for service or recalibration.
Critical safety warnings and procedures for installation, including explosive atmospheres.
General requirements and guidelines for installing the device in various piping configurations.
Specifics on brackets, gaskets, wafer-type designs, and flow direction.
Correct orientation of the electrode axis and preferred mounting positions.
Procedures for proper grounding, sensor insulation, and inlet/outlet pipe configurations.
Step-by-step guide on physically installing the flowmeter sensor into the piping.
Guidelines for selecting a location and mounting the transmitter in a remote configuration.
Procedures for safely opening, closing, and sealing the device housing.
Instructions on how to install optional plug-in cards to extend device functionality.
Critical safety warnings for electrical connections and requirements for explosive atmospheres.
Procedures and guidelines for properly grounding the sensor and measurement system.
Specific methods for grounding sensors in metal pipes (fixed/loose flanges) and plastic pipes.
Guidelines for connecting the power supply, including circuit breakers and cable compliance.
Diagram and description of terminal connections for power supply, inputs/outputs, and signal cables.
Wiring diagrams and terminal assignments for integral mount designs.
Wiring diagrams and terminal assignments for the transmitter in remote mount designs.
Information on using HART and Modbus protocols for device communication and parameterization.
Information on PROFIBUS DP protocol and requirements for fieldbus communication cables.
Safety warnings for commissioning and configuring hardware functions using DIP switches.
Steps for parameterizing the device using a PC/notebook and local interface.
Using infrared adapter or HART modem for device parameterization.
Step-by-step guide to configuring common parameters using the 'Easy Setup' menu.
Safety warnings during operation and how to navigate the device's LCD display.
Description of the different menu levels: Process Display, Information, and Configuration.
How process values are displayed and how to access information and diagnostic screens.
Understanding error messages and accessing the configuration level for parameterization.
Functions for detecting and alarming partial filling and gas bubbles in the medium.
Monitoring conductivity and electrode impedance with alarm capabilities.
Monitoring coil parameters, sensor temperature, and grounding integrity.
Comparing device states from manufacture to current state using the SensorMemory.
Safety warnings for maintenance, including live parts, hot media, and component protection.
Steps and safety precautions for safely removing, recycling, and disposing of the device.
Limits for pipe vibration and temperature limits for device cleaning.
Ambient and medium temperature ranges for ProcessMaster sensors based on materials.
Ambient and medium temperature ranges for HygienicMaster sensors based on materials.
Permissible operating pressure and temperature limits based on liner and flange material.
A form to be completed for device returns, detailing contamination and defect information.
Tightening torque values for flange and wafer-type designs based on material and diameter.
Tightening torque values for flange and wafer-type designs based on material and diameter.
Tightening torque values for HygienicMaster with variable process connections.