1. SERVICE PRECAUTIONS
For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
Do NOT use a soldering iron whose tip temperature cannot be controlled.
The part listed below is difficult or impossible to replace as a discrete component part.
When the part listed in the table is defective, replace whole Assy.
Assy Name
Parts that is Diffcult to Replace
Ref No. FunctionPart No. Remarks
MAIN Assy
IC2002 CLK GENERATORSI5351C-B03300GM IC with heat-pad
IC206 12V r 1.285 DC/DC ConverterBD9328EFJ IC with heat-pad
USBP Assy
IC3152 High Side SWTPS2557DRB IC with heat-pad
HPPW Assy
IC6301 12V r ±7V DC/DC ConverterBD9851EFV IC with heat-pad
AIN Assy
IC4701 CH1 to CH4 ADCAK5578EN IC with heat-pad
IC4801 CH5, CH6 ADCAK5574EN IC with heat-pad
IC402 PMIC(AM3352)TPS65910A31A1RSL IC with heat-pad
IC212
12V r 3.3V Regulator
UA78M33IKVUG3 IC with heat-pad
IC1401
1.35V r 0.675V VTT Regulator
LP2996AMR IC with heat-pad
Q1001 FETCSD87330Q3D Transistor with heat-pad
IC903 LAN PHYLAN8720A-CP IC with heat-pad
IC213
5V r 3.3V Regurator
UA78M33IKVUG3 IC with heat-pad
IC211
12V r 9V Regulator
NJM78M09DL1A IC with heat-pad
IC401 USB/ETHER UCOMAM3352BZCZA100@V BGA
IC701 DDR3 SDRAMK4B1G1646I-BYMA BGA
IC1901 SUB DSPD810K013DZKB456 BGA
IC1101 MAIN CPU/DSP66AK2G12ABYA100 BGA
IC1402, IC1403 DDR3L SDRAMMT41K64M16TW107AIT BGA
IC1001 PMIC(66AK)TPS65911AA2ZRC BGA
IC1502
FLASH ROM(64Mb)
W25Q64JVSSIQ *1
*1 : Refer to "1.3 SERVICE NOTICE"_"g Confirmation of user-setting".
IC1504
Authentication Coprocessor
H337S3959 USON IC
To Next Page
Loading...