Dell PowerEdge R860 - Thermal Restriction Matrix

Table 27. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
Thermal restriction matrix
Table 28. Processor and heat sink matrix
Heat sink Processor TDP
STD HSK ≤ 185 W
L-type HPR HSK 195 W to 250 W
L-type VHPR HSK ≥ 270 W
Table 29. Label reference
Label Description
HPR High performance
VHPR Very High Performance
HSK Heat sink
LP Low Profile
FH Full Height
DLC Direct Liquid Cooling
NOTE: The ambient temperature of the configuration is determined by the critical component in that configuration. For
example, if the processor's supported ambient temperature is 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is
30°C (86°F), the combined configuration can only support 30°C (86°F).
Table 30. Thermal restriction matrix for air cooled configurations
Configuration
24 x
2.5-inch
NVMe
16 x
2.5-inch
SAS + 8
x 2.5-
inch
NVMe
24 x 2.5-inch SAS
16 x 2.5-
inch
NVMe
16 x 2.5-
inch SAS
8 x 2.5-
inch SAS
Rear storage
No Rear
Drives
No Rear
Drives
No Rear
Drives
2 x 2.5-
inch
SAS/
NVMe
No Rear
Drives
No Rear
Drives
No Rear
Drives
Processor
TDP
T-Case max center
(°C)
Ambient temperature
165 W 82
35°C
(95°F)
35°C
(95°F)
45°C
(113°F)
35°C
(95°F)
35°C
(95°F)
45°C
(113°F)
45°C
(113°F)
185 W 81
35°C
(95°F)
35°C
(95°F)
40°C
(104°F)
35°C
(95°F)
35°C
(95°F)
40°C
(104°F)
40°C
(104°F)
195 W 64
35°C
(95°F)
35°C
(95°F)
40°C
(104°F)
35°C
(95°F)
35°C
(95°F)
40°C
(104°F)
40°C
(104°F)
250 W 83
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
250 W 76
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
35°C
(95°F)
Technical specifications 35