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Dell PowerEdge R860 - Page 37

Dell PowerEdge R860
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Table 31. Air cooling thermal restriction for 24 x 2.5-inch NVMe/16 x 2.5-inch + 8 x NVMe/16 x NVMe
Storage Configurations (continued)
ASHRAE A2/35°C (95°F) A3/40°C (104°F) A4/45°C (113°F)
DIMM
256 GB RDIMMs only support 1DPC
Maximum 35°C for 128 GB RDIMM or
greater capacity RDIMMs
128 GB, or greater capacity DIMMs are not supported.
NVMe
storage
2.5-inch NVMe storage is supported. 2.5-inch NVMe storage is not supported.
OCP OCP cooling tier >5 is supported
OCP cooling tier >5 is not supported
85°C active optics cable is required
BOSS BOSS-N1 is supported. BOSS-N1 is not supported.
Table 32. Air cooling configurations thermal restriction for 8 x 2.5-inch/16 x 2.5-inch Storage
Configuration
ASHRAE A2/35°C (95°F) A3/40°C (104°F) A4/45°C (113°F)
Processor
CPUs 330 W are not supported.
Maximum 30°C for CPU 330 W
CPUs 195 W are supported. Only 165 W is supported
PSU Two PSUs are required in redundant mode. If there is a PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA Not supported
DIMM
256 GB RDIMMs only support 1DPC
Maximum 35°C for 128 GB RDIMM or
greater capacity RDIMMs
128 GB, or greater capacity DIMMs are not supported.
NVMe
storage
2.5-inch NVMe storage is not supported.
OCP OCP cooling tier >5 is supported
OCP cooling tier >5 is not supported
85°C active optics cable is required
BOSS BOSS-N1 is supported. BOSS-N1 is not supported.
Technical specifications 37

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