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Denon AVR-3311CI Service Manual

Denon AVR-3311CI
216 pages
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D&M Holdings Inc.
SERVICE MANUAL
e
e
Copyright 2010 D&M Holdings Inc. All rights reserved.
WARNING: Violators will be prosecuted to the maximum extent possible.
MODEL JP E3 E2 EK KA E1 E1K E1C
AVR-3311CI
P
AVR-3311
P P
AV SURROUND RECEIVER
Ver. 5
•
Some illustrations using in this service manual are slightly different from the actual set.
•
Please use this service manual with referring to the operating instructions without fail.
•
For purposes of improvement, specications and design are subject to change without notice.
S0156-1V05DM/DG1010
s
Please refer to the
MODIFICATION NOTICE.

Table of Contents

Other manuals for Denon AVR-3311CI

Questions and Answers:

Denon AVR-3311CI Specifications

General IconGeneral
Channels7.2
Amplifier TypeDiscrete
Power Output (8 ohms)125 W
HDMI Inputs6
HDMI Outputs2
Response Bandwidth10 Hz - 100 kHz
Signal-To-Noise Ratio102 dB
THD0.05 %
Input Impedance47 kOhms
Input Sensitivity200 mV
Tuner TypeDigital
Tuner BandsAM/FM
HDMI SwitchingYes
3D TechnologyYes
Audio D/A Converter192kHz/24-bit
Digital Sound Processor (DSP)Yes
DSP Preset Qty7
Frequency Response10 Hz - 100 kHz
HDMI Version1.4a
USB PortYes
Audio Formats SupportedDolby TrueHD, DTS-HD Master Audio
Network ConnectivityEthernet
Video Inputs3
Video Outputs1
Audio Outputs2
HDMI FeaturesARC, CEC
Supported Video Formats1080p

Summary

SAFETY PRECAUTIONS

LEAKAGE CURRENT CHECK

Checks leakage current and resistance for safety compliance.

TECHNICAL SPECIFICATIONS

Audio Section

Details power amplifier, analog, digital, and phono specifications.

Video Section

Details standard and component video connector specs.

HD Radio section (for E3)

Specifications for HD Radio reception.

Tuner section (for E2, E1C)

Specifications for FM/AM tuner reception.

General

Power supply, power consumption, dimensions, and weight.

CAUTION IN SERVICING

Before the Digital P.W.B. are replaced

Procedure for initializing the μcom before replacing digital PWB.

Initializing AV SURROUND RECEIVER

Steps for initializing the receiver's μcom and peripherals.

Service Jigs

Connection of PCB HDMI JIG

Instructions for connecting the PCB HDMI JIG for servicing.

DISASSEMBLY

FRONT PANEL ASSY

Steps for disassembling the front panel assembly.

HEAT SINK ASSY

Steps for disassembling the heat sink assembly.

PCB REG CNT/PCB REG

Steps for disassembling the PCB REG CNT/PCB REG.

HDMI UNIT ASSY

Steps for disassembling the HDMI unit assembly.

TRANS MAIN

Steps for disassembling the main transformer unit.

1. FRONT PANEL ASSY

2. HEAT SINK ASSY

3. PCB REG CNT/PCB REG

4. HDMI UNIT ASSY

5. TRANS MAIN

SPECIAL MODE

Special mode setting button

Details how to press ON/STANDBY with other buttons to access special modes.

1. µcom/DSP Version display mode

1.1. Operation specifications

Describes how to enter and use the µcom/DSP version display mode.

1.2. Display Order

Explains the sequence of information displayed in the version mode.

1.3. Error display

2. Errors checking mode (Displaying the protection history)

2.1. Operation specifications

How to start and use the error mode to display protection history.

2.2. About the display on the FL display

Explains the history display format and meaning of different codes.

2.3. Clearing the protection history

Warning indication by the POWER LED

Explains POWER LED flashing patterns for protection incidents.

3. DIAGNOSTIC MODE (Video/Audio (signal) path confirmation mode)

3.1. Starting diagnostic mode

How to start the diagnostic mode using buttons.

3.2. Canceling diagnostic mode

How to cancel the diagnostic mode.

3.3. Operation

How to perform remote operations in diagnostic mode.

3.4. Video system confirmation items

Lists items to confirm for video signal paths.

3.5. Audio system confirmation items

Analog (signal) Path

Confirmation steps for analog signal paths in different zones.

DIGITAL (signal) Path (MAIN)

Confirmation steps for digital signal paths in the main zone.

DIGITAL (signal) Path (ZONE2)

Confirmation steps for digital signal paths in ZONE2.

DIGITAL (signal) Path (ZONE3)

Confirmation steps for digital signal paths in ZONE3.

HDMI (signal) Path

Confirmation steps for HDMI signal paths.

AUDIO BLOCK DIAGRAM

VCC DIAGRAM

ADJUSTMENT

Idling Current

Procedure for adjusting idling current for audio section.

TROUBLE SHOOTING

1. POWER

Troubleshooting steps for power-related issues.

2. Analog video

MONITOR OUT (CVBS) output NG

Troubleshooting flow for CVBS monitor output issues.

MONITOR OUT (Component) output NG

Troubleshooting flow for Component monitor output issues.

3. HDMI/DVI.

3.1. No picture or sound is output

Troubleshooting steps for HDMI/DVI connection issues resulting in no picture/sound.

2.2. HDMI test point and waveforms

4. AUDIO

4.1. AUDIO CHECK

Troubleshooting procedure for audio output issues.

4.2. Power AMP (7CH AMP B'D)

4.3. Analog audio

5. Network/USB

5.1. Cannot connect to network

Troubleshooting steps for network connectivity issues.

5.2. USB device is not recognized

5.3. No picture or sound is output

CLOCK FLOW & WAVE FORM IN DIGITAL BLOCK

LEVEL DIAGRAM

FRONT ch

Illustrates signal levels for the front channel.

LEVEL DIAGRAM

CENTER ch

Illustrates signal levels for the center channel.

LEVEL DIAGRAM

SUBWOOFER ch

Illustrates signal levels for the subwoofer channel.

LEVEL DIAGRAM

SURROUND ch

Illustrates signal levels for the surround channel.

LEVEL DIAGRAM

SURR.BACK ch

Illustrates signal levels for the surround back channel.

LEVEL DIAGRAM

ZONE2/3

Illustrates signal levels for ZONE2/3.

PRINTED WIRING BOARDS

7CH-AMP (COMPONENT SIDE)

Component layout of the 7CH AMP PCB.

7CH-AMP (FOIL SIDE)

Foil layout of the 7CH AMP PCB.

SMPS (COMPONENT SIDE)

SMPS (FOIL SIDE)

Foil layout of the SMPS PCB.

SPK (COMPONENT SIDE)

SPK (FOIL SIDE)

Foil layout of the speaker PCB.

REG (COMPONENT SIDE)

REG (FOIL SIDE)

Foil layout of the REG PCB.

FRONT_CNT (COMPONENT SIDE)

FRONT_CNT (FOIL SIDE)

Foil layout of the FRONT_CNT PCB.

REG_CNT (COMPONENT SIDE)

REG_CNT (FOIL SIDE)

Foil layout of the REG_CNT PCB.

SIDE_CNT (COMPONENT SIDE)

SIDE_CNT (FOIL SIDE)

Foil layout of the SIDE_CNT PCB.

USB (COMPONENT SIDE)

USB (FOIL SIDE)

Foil layout of the USB PCB.

MIC (COMPONENT SIDE)

MIC (FOIL SIDE)

Foil layout of the MIC PCB.

FRONT (COMPONENT SIDE)

FRONT (FOIL SIDE)

Foil layout of the FRONT PCB.

FUNCTION_CNT (COMPONENT SIDE)

FUNCTION_CNT (FOIL SIDE)

Foil layout of the FUNCTION_CNT PCB.

VAUX (COMPONENT SIDE)

VAUX (FOIL SIDE)

Foil layout of the VAUX PCB.

VIDEO (COMPONENT SIDE)

VIDEO (FOIL SIDE)

Foil layout of the VIDEO PCB.

FUNCTION (COMPONENT SIDE)

FUNCTION (FOIL SIDE)

Foil layout of the FUNCTION PCB.

HDMI (COMPONENT SIDE)

HDMI (FOIL SIDE)

Foil layout of the HDMI PCB.

FRONT HDMI (COMPONENT SIDE)

FRONT HDMI (FOIL SIDE)

Foil layout of the FRONT HDMI PCB.

AUDIO[INPUT] (COMPONENT SIDE)

AUDIO[INPUT] (FOIL SIDE)

Foil layout of the AUDIO[INPUT] PCB.

PREOUT (COMPONENT SIDE)

PREOUT (FOIL SIDE)

Foil layout of the PREOUT PCB.

AMP B'D 1/2

AMP B'D 2/2

AUDIO

SPK_SMPS 1/2

SPK_SMPS 2/2

Foil layout of the SMPS PCB.

REGULATOR B'D

REG_SIRIUS_COMMON CNT 1/4

Wiring diagram and pin assignments for REG_SIRIUS_COMMON.

REG_SIRIUS_COMMON CNT 2/4

Wiring diagram and pin assignments for REG_SIRIUS_COMMON.

REG_SIRIUS_COMMON CNT 4/4

Wiring for SIRIUS, RS232C, and trigger connections.

FRONT CONNECTOR

REG_SIRIUS_COMMON CNT 3/4

Wiring diagram and pin assignments for REG_SIRIUS_COMMON.

AUDIO

AMP B'D 1/2

AUDIO

AMP B'D 1/2

VIDEO BLOCK DIAGRAM

VIDEO BLOCK DIAGRAM

D-TERMINAL

HDMI (COMPONENT SIDE)

HDMI (FOIL SIDE)

Foil layout of the HDMI PCB.

FRONT HDMI (COMPONENT SIDE)

FRONT HDMI (FOIL SIDE)

Foil layout of the FRONT HDMI PCB.

HDMI RX

V ENCODER

HDMI TX

V ENCODER

HDMI TX

DIR

AUDIO PLD

DSP

MAIN DAC

ZONE DAC

ETHERNET PHY

USB TCC8600

SPK_SMPS 2/2

DIGITAL CONNECT

CPU LEVEL CHG

MAIN CPU

HDMI TX

FRONT B'D

WIRING DIAGRAM

PACKING VIEW

PARTS LIST OF EXPLODED VIEW

SEMICONDUCTORS GROUP

List of semiconductor parts used in the exploded view.

CAPACITORS GROUP

List of capacitor parts used in the exploded view.

OTHERS PARTS GROUP

List of miscellaneous other parts.

SCREWS

List of screws used in the unit.

WIRES

List of wires and cables used in the unit.

SEMICONDUCTORS

1. IC's

Details of major semiconductors (ICs) used in the unit.

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