Module specifications Thermal specifications
Digi Connect ME, Wi-ME, ME 9210, Wi-ME 9210 Hardware Reference Manual
44
Standard operating temperature ranges
Product Operating temperature range
Digi Connect ME -40 °C to +85°C
Digi Connect ME 9210
p-40°C to +80°C
Digi Connect Wi-ME p p-30°C to +75°C
The lower standard operating temperature ranges are specified without restrictions, except
condensation must not occur.
The upper operating temperature limit depends on the host PCB layout and surrounding
environmental conditions. To simplify the customer’s design process, a maximum case temperature
has been specified.
Maximum case temperature
Product Maximum case temperature
Digi Connect ME 96°C
Digi Connect ME 9210 93°C
Digi Connect Wi-ME 85°C
The maximum case temperature must remain below the maximum, measured at the location shown
in the figure on the previous page.
Additional design recommendations
The following list provides additional design guidance with respect to thermal management in
applications with operating temperatures at the high end or beyond the specified standard ambient
temperature range.
n Providing air movement will improve heat dissipation.
n The host PCB plays a large part in dissipating the heat generated by the module. A large
copper plane located under the Digi Connect ME 9210 is soldered to the module’s mounting
tabs will improve the heat dissipation capabilities of the PCB.
n If the design allows, added buried PCB planes will also improve heat dissipation. The copper
planes create a larger surface to spread the heat into the surrounding environment.
n Adding a thermal pad or thermal compound, such as Sil-Pad
®
, Gap Pad
®
or Gap Filler products
made by the Bergquist Company (www.bergquistcompany.com), between the host PCB and
the underside of the module will significantly increase the thermal transfer between the
module’s enclosure and the host PCB. Limit the fill area to the folded metal portion of the
module’s underside.
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