EMC CLARiiON DAE2P - Page 74

DAE2P/DAE3P Hardware Reference
i-2
Index
drive carrier 1-11
drive specifications A-3
disks
configuration rules 2-15
documentation, related x
drive carrier description 1-11
E
EA (enclosure address)
indicator 3-4
requirements 2-10
setting 2-11
EA indicator 3-4
electromagnetic interference (EMI)
shield 1-6
standards certification/compliance iv
electrostatic discharge (ESD)
avoiding 3-7
enclosure
description 1-3
EA indicator 3-4
midplane description 1-6
rear, description 1-5
Enclosure Address (EA)
requirements 2-10
setting 2-11
Enclosure ID, see Enclosure Address
environmental recovery A-5
F
FC-AL (Fibre Channel Arbitrated Loop)
cabling A-3
requirements 2-2
connector A-3
interface specifications A-3
physical address 2-10
Fibre Channel
related standards A-4
front bezel
description 1-6
unlocking and removing 3-12
FRUs (field-replaceable units)
defined 1-3
disk module
description 1-9
removing 3-13
handling 3-6
LCC
description 1-8
replacing 3-17
power issues 3-6
power supply
description 1-11
replacing 3-20
storing 3-6
G
grounding xiii
H
help 1-xii
hot spare
restrictions 2-15
I
indicators, ID 3-4
installation requirements 2-2
installing
DAE2P in cabinet 2-3
disk filler modules 3-14
L
LCC (link control card)
cabling A-3
requirements 2-2
description 1-8
FC-AL connector A-3
reattaching cables to 3-19
removing copper cables 3-17
replacing 3-17
status light
Active 3-6
status lights 1-9
lights, DAE2P status 3-2
M
midplane 1-6
monitoring 3-2