EMC HD400 - Reportable Materials on the HD400

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WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
11.0 Reportable Materials on the HD400
Table 11 lists components that require selective treatment.
Table 11 Complete list of Reportable Materials on HD400 Components
Material
Item
Location
Polychlorinated biphenyl (PCB) containing capacitors
and all Polychlorinated Terphenyl (PCT) containing
electrical equipment
Absent
Mercury – containing components such as switches or
backlighting lamps
Absent
Batteries & Accumulators
Battery module contained in the Suitcase
Assembly
Printed circuit boards of mobile phones generally, and
of other devices if the surface of the printed circuit
board is greater than 10 cm
2
1, 24, 25, 26,
27, 28, 29, 30,
31, 32, 33, 34,
16
17
43
40
35
PCBs
Power Supply Main PCB
Power Supply Daughter PCBs
Fan Module
3.5-inch Hard Disk Drive
2.5-inch Hard Drive
Base Board PCB
Ink & toner cartridges, liquid and pasty, as well as
color toner
Absent
Plastic containing brominated flame retardants
Absent
Asbestos waste and components which contain
asbestos
Absent
Cathode ray tubes
Absent
Chlorofluorocarbons (CFC), Hydrochlorofluorocarbons
(HCFC), Hydrofluorocarbons (HFC)or,
Hydrocarbons (HC)
Absent
Gas discharge lamps
Absent