EMC HD400 User Manual

5
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
6.0 Acronyms
Table 1 defines acronyms that may be used in the document.
Table 1 Acronyms List
ABS
Acrylonitrile butadiene styrene
Ag
Silver
Au
Gold
BBU
Battery Backup Unit
Cd
Cadmium
CFC
Chlorofluorocarbons
CPU
Central Processing Unit
Cr Vl
Hexavalent Chromium
Cu
Copper
DIMMs
Dual in-line Memory Modules
DPE
Disk Processor Enclosure
DRL
Device Regulatory Label
EMI
Electromagnetic Interference
ESD
Electrostatic discharge
EU
European Union
GWP
Global Warming Potential
HC
Hydrocarbons
HCFC
Hydrochlorofluorocarbons
HDPE
High-Density Polyethylene
Hg
Mercury
ICM
Interconnect Module
LCC
Link Control Card
LDPE
Low-Density Polyethylene
Pb
Lead
PBB
Polybrominated Biphenyls
PBDE
Polybrominated Diphenyl Ethers
PC
Polycarbonate
PCB
Printed Circuit Board
PCT
Polychlorinated Terphenyl
Pd
Palladium
PETE or PET
Polyethylene Terephthalate

EMC HD400 Specifications

General

Brand	EMC
Model	HD400
Category	Enclosure
Language	English