3
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
Table of Contents
1.0 Document Purpose ............................................................................................................... 4
2.0 Important Notice ................................................................................................................... 4
3.0 How to Use these Instructions ............................................................................................. 4
4.0 Related Documentation ........................................................................................................ 4
5.0 Brand Owner Identification .................................................................................................. 4
6.0 Acronyms ............................................................................................................................. 5
7.0 Product Identification ........................................................................................................... 7
7.0.1 HD400 DPE .......................................................................................................................... 7
8.0 Product Photos ..................................................................................................................... 8
9.0 Locating Main Assemblies with Reportable Materials ........................................................ 9
9.0.2.1 Locating materials on a Fan Module ............................................................................... 10
9.0.2.2 Locating Materials on a Power Supply ........................................................................... 12
9.0.2.3 Locating Materials on the Suitcase ............................................................................. 13
9.0.2.3.1 HD400 PCBs ............................................................................................................... 15
9.0.2.4 Locating Materials on the Base Board PCB ................................................................ 19
10.0 HD400 Accessories and Optional Equipment ................................................................. 19
10.0.1 Locating Materials on a 3.5-inch Hard Disk Drive ............................................................ 21
10.0.2 Locating Materials on a 2.5-inch Hard Disk Drive ............................................................ 22
11.0 Reportable Materials on the HD400 ................................................................................. 23
11.1 Materials of Interest to Recyclers .................................................................................... 25
11.2 Precious Metals ................................................................................................................ 27
11.3 Plastic Part Markings ....................................................................................................... 27
12.0 Disassembly Details ......................................................................................................... 28
12.0.1 Required Tools for Disassembly ...................................................................................... 28
12.0.2 Safety Precautions ........................................................................................................... 28
12.0.3 Disassembling the HD400 Enclosure ........................................................................... 29
12.0.3.1 Removing a Hard Disk Drive ...................................................................................... 29
12.0.3.1.1 Disassembling a 3.5-inch Hard Disk Drive ............................................................ 30
12.0.3.1.2 Disassembling a 2.5-inch Hard Disk Drive ............................................................ 32
12.0.3.2 Removing the Front Panel ......................................................................................... 33
12.0.3.1 Disassembling a fan module .................................................................................... 36
12.0.3.4 Removing the Power Supplies ................................................................................... 37
12.0.3.4.1 Disassembling the Power Supply .............................................................................. 38
12.0.3.5 Removing the Suitcase .............................................................................................. 39
15.0.5.1 Removing Components from the Suitcase ............................................................... 40
12.0.3.6 Disassembling the Chassis to Retrieve the Base Board PCB ................................ 58
16.0 RoHS Restricted Materials ............................................................................................... 64
To Next Page
Loading...
Need help?
General
