6 Thermal Design
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6 Thermal Design
6.1 Overview
The design guidelines provided in this document are general guidelines. There may b
e unavoidable differences between different products. When designing a specific interf
ace circuit, please pay attention to the specific characteristics of the hardware and so
ftware of the module.
Before designing the hardware:
Refer to the Pin Definition section for details on the attributes of each pin in the module.
Prepare SCH component library and PCB package library.
6.2 Thermal Basis
Conductive heat dissipation
Conductive heat dissipation refers to the transfer of energy through kinetic energy between
molecules of objects when they contact.
Heat sink/shell with larger surface area dissipates heat better.
The smaller distance between the cooling system and heat source is preferred.
Materials with high thermal conductivity are preferred, generally: solid > liquid > gas.
Thermal resistance
During two solid surfaces contact, the actual contact is only the area of some discrete parts
due to limit of the material processing procedure. The gap between the non-contact surfaces
is filled with air, and generates a large thermal resistance.
Methods of reducing the thermal resistance include increasing contact pressure and
increasing materials (thermal conductive silicone) to fill the gap between the surfaces.
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