Fibocom MG661-EU - Product Structure

6 Thermal Design
65
ModuleModule
Bad Better
Copper
Dielectric
Figure 30. PCB stack
Figure 31. PCB hole comparison
6.3.2 Product Structure
Recommendations for structure design:
Reduce the distance between module and heat sink and shell. Thermal conductive material
thickness should not exceed 3 mm.
The thermal conduction path is shown in the following figure.
Tim
Shield
Tim
Parts
Tim
Main board
Shell
Radiator
g
Module
Cold air
Hot air
Figure 32. Thermal conduction path
Use shell material with better thermal conductivity to facilitate cooling. Thermal conductivity
sequence: Al > Fe > Plastic.
Place the heat sink above the module.