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Introduces the MG661 module as a broadband wireless terminal product.
Details the basic configuration and characteristics of the MG661 module hardware.
Presents the internal structural block diagram of the MG661 module.
Describes the MG661 development boards provided for customer development.
Defines the attributes used to describe pins, including I/O, voltage, and description.
Details the pin distribution of the MG661 module, designed with LGA package.
Provides detailed information about specific pins, categorized by interface type.
Describes the electrical and limit voltage indicators for power supply.
Explains the background and power supply limit for module operation.
Details the module power interface, specifically VDD_EXT.
Covers control interfaces for power-on, power-off, and reset operations.
Describes the power-on sequence and reference circuits for controlling PWRKEY.
Explains hardware and software methods for powering off the module.
Details hardware and software reset methods and timing sequences.
Explains the USB download function and provides a reference circuit.
Discusses baseband interfaces, including USB 2.0, UART, and I2C.
Details the USB 2.0 interface, its function, and circuit design considerations.
Describes the UART interface, baud rates, and serial port level conversion.
Explains the I2C bus, its characteristics, and PCB design considerations.
Details the PCM/I2S interface for external codec and audio.
Covers SIM card interface, including detection, hot plug, and PCB design.
Describes the Analog-to-Digital Converter (ADC) function and PCB design.
Explains the network and operating status indication pins (NET_STATUS, STATUS).
Details the LCD interface capabilities and reference design.
Describes the CAMERA interface capabilities and reference design.
Outlines the different operating modes supported by the module.
Explains how to enter and exit flight mode using hardware or software control.
Details how to enter and exit sleep mode for power saving.
Describes the PSM (Power Saving Mode) characteristics and configuration.
Lists RF indicators like operating band, modulation, and peak rate.
Covers antenna interface, classification, and impedance design principles.
Introduces antenna interface, classification, and placement recommendations.
Details impedance design principles for RF signal routing and PCB layout.
Explains the network analyzer and anechoic chamber setup for passive testing.
Specifies operating, extended, and storage temperature/humidity ranges.
Lists industrial reliability test items and their corresponding test conditions.
Details ESD sensitive component precautions and allowable discharge ranges.
Provides general design guidelines and considerations for hardware design.
Explains conductive and convective heat dissipation principles.
Offers recommendations for main board design and PCB layout.
Provides recommendations for main board design, including PCB size and layers.
Offers recommendations for structure design regarding heat sinks and thermal paths.
Shows schematic diagrams of the MG661 module's top and bottom views.
Details the packaging mode, weight, package type, and dimensions.
Describes the module's tape packaging, layers, and handling precautions.
Provides detailed dimensions for the carrier tape used in packaging.
Specifies recommended storage conditions and period for the module.
Refers to external document for SMT stencil, solder paste, and oven control.
Provides critical installation and compliance notices for OEM integrators.
Specifies requirements for FCC ID labeling on the final host device.
Details antenna installation requirements, co-location, and gain limitations.
Instructs OEM integrators on end-user manual content regarding RF module.
States compliance with FCC Part 15 rules and limits for Class B digital devices.
Outlines FCC rules, operational conditions, and limited module procedures.
Explains limited module procedures and RF exposure evaluation requirements.
Provides guidance on trace antenna designs for modular transmitters.
States RF exposure conditions for host manufacturer use and end-user manuals.
Lists antennas included in certification and acceptable antenna types/gain.
Details label and compliance information, including FCC ID requirements.
Provides disclaimer for additional testing, Part 15 Subpart B.
Lists FCC rules applicable to the modular transmitter for approval.
Describes use conditions, antenna limits, and gain for the modular transmitter.
Explains limited module procedures and RF exposure evaluation requirements.
Provides guidance on trace antenna designs for modular transmitters.
States RF exposure conditions for host manufacturer use and end-user manuals.
Lists antennas included in certification and acceptable antenna types/gain.
Details label and compliance information, including FCC ID requirements.
Provides disclaimer for additional testing, Part 15 Subpart B.
Introduces the MG661 module as a broadband wireless terminal product.
Details the basic configuration and characteristics of the MG661 module hardware.
Presents the internal structural block diagram of the MG661 module.
Describes the MG661 development boards provided for customer development.
Defines the attributes used to describe pins, including I/O, voltage, and description.
Details the pin distribution of the MG661 module, designed with LGA package.
Provides detailed information about specific pins, categorized by interface type.
Describes the electrical and limit voltage indicators for power supply.
Explains the background and power supply limit for module operation.
Details the module power interface, specifically VDD_EXT.
Covers control interfaces for power-on, power-off, and reset operations.
Describes the power-on sequence and reference circuits for controlling PWRKEY.
Explains hardware and software methods for powering off the module.
Details hardware and software reset methods and timing sequences.
Explains the USB download function and provides a reference circuit.
Discusses baseband interfaces, including USB 2.0, UART, and I2C.
Details the USB 2.0 interface, its function, and circuit design considerations.
Describes the UART interface, baud rates, and serial port level conversion.
Explains the I2C bus, its characteristics, and PCB design considerations.
Details the PCM/I2S interface for external codec and audio.
Covers SIM card interface, including detection, hot plug, and PCB design.
Describes the Analog-to-Digital Converter (ADC) function and PCB design.
Explains the network and operating status indication pins (NET_STATUS, STATUS).
Details the LCD interface capabilities and reference design.
Describes the CAMERA interface capabilities and reference design.
Outlines the different operating modes supported by the module.
Explains how to enter and exit flight mode using hardware or software control.
Details how to enter and exit sleep mode for power saving.
Describes the PSM (Power Saving Mode) characteristics and configuration.
Lists RF indicators like operating band, modulation, and peak rate.
Covers antenna interface, classification, and impedance design principles.
Introduces antenna interface, classification, and placement recommendations.
Details impedance design principles for RF signal routing and PCB layout.
Explains the network analyzer and anechoic chamber setup for passive testing.
Specifies operating, extended, and storage temperature/humidity ranges.
Lists industrial reliability test items and their corresponding test conditions.
Details ESD sensitive component precautions and allowable discharge ranges.
Provides general design guidelines and considerations for hardware design.
Explains conductive and convective heat dissipation principles.
Offers recommendations for main board design and PCB layout.
Provides recommendations for main board design, including PCB size and layers.
Offers recommendations for structure design regarding heat sinks and thermal paths.
Shows schematic diagrams of the MG661 module's top and bottom views.
Details the packaging mode, weight, package type, and dimensions.
Describes the module's tape packaging, layers, and handling precautions.
Provides detailed dimensions for the carrier tape used in packaging.
Specifies recommended storage conditions and period for the module.
Refers to external document for SMT stencil, solder paste, and oven control.
Provides critical installation and compliance notices for OEM integrators.
Specifies requirements for FCC ID labeling on the final host device.
Details antenna installation requirements, co-location, and gain limitations.
Instructs OEM integrators on end-user manual content regarding RF module.
States compliance with FCC Part 15 rules and limits for Class B digital devices.
Outlines FCC rules, operational conditions, and limited module procedures.
Explains limited module procedures and RF exposure evaluation requirements.
Provides guidance on trace antenna designs for modular transmitters.
States RF exposure conditions for host manufacturer use and end-user manuals.
Lists antennas included in certification and acceptable antenna types/gain.
Details label and compliance information, including FCC ID requirements.
Provides disclaimer for additional testing, Part 15 Subpart B.
Lists FCC rules applicable to the modular transmitter for approval.
Describes use conditions, antenna limits, and gain for the modular transmitter.
Explains limited module procedures and RF exposure evaluation requirements.
Provides guidance on trace antenna designs for modular transmitters.
States RF exposure conditions for host manufacturer use and end-user manuals.
Lists antennas included in certification and acceptable antenna types/gain.
Details label and compliance information, including FCC ID requirements.
Provides disclaimer for additional testing, Part 15 Subpart B.
General| Form Factor | M.2 |
|---|---|
| Network Technology | 5G NR, LTE, WCDMA |
| 5G Download Speed | 2.4 Gbps |
| Operating Voltage | 3.3V |
| Storage Temperature | -40°C to +85°C |
| GNSS Support | GPS, GLONASS, BeiDou, Galileo, QZSS |
| Category | Cellular Module |
| Module Type | 5G Sub-6 GHz |
| 5G Bands | n1, n3, n5, n7, n8, n20, n28, n38, n41, n77, n78, n79 |
| LTE Bands | B1, B3, B5, B7, B8, B20, B38, B40, B41 |
| WCDMA Bands | B1, B5, B8 |
| Interfaces | PCIe, USB |
| Dimensions | 30mm x 52mm x 2.3mm |
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