Fibocom MG661-EU - Thermal Basis; Thermal Design; Main Board

6 Thermal Design
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Thermal convection
Convective heat dissipation is an energy exchange in which a fluid flows over a solid surface.
Heat sink/shell with larger surface area dissipates heat better.
6.3 Thermal Design
6.3.1 Main Board
Recommendations for main board design:
Increase PCB size, and keep the module away from other heat source devices.
Heat source Module Heat source Module
Bad Better
Figure 29.PCB layout
Increase PCB layers and the copper area at each layer.
Add adequate paths under and near the module. Plated holes boast better cooling effect than
buried holes and blind holes. Vertically stacked paths boast better cooling effect than
staggered paths.