Huawei SE2900 - 1.5 F8002 Subrack System Topology Structure

HUAWEI SE2900 Session Border Controller
Hardware Description
1 Service Processing Device
Issue 01 (2016-01-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
30
Technical Specifications
Table 1-20 lists the technical specifications of the fan tray.
Table 1-20 Technical specifications of a fan tray
Item
Specifications
Mechanical
specificatio
ns
Dimensions (H x W x
D)
124.5 mm x 131.0 mm x 124.7 mm (4.90 in. x
5.16 in. x 4.91 in.)
Weight
1.7 kg (3.75 lb)
Electrical
specificatio
ns
Total power inputs
Two power inputs are provided by the backplane
in the subrack.
Maximum power
consumption
140 W
Typical power
consumption
20 W
Environme
ntal
specificatio
ns
Temperature

Long-term operating temperature: 0°C to
70°C (32°F to 158°F)

Storage temperature: -40°C to +70°C (-40°F
to +158°F)
Noise
66 dBA
1.5 F8002 Subrack System Topology Structure
1.5.1 CAN Bus
Functions
The controller area network (CAN) bus performs board power management and transmits
subrack information between the MXUs and service boards. Figure 1-23 shows the CAN bus
connections.