Name: Intel Celeron D
Brand: Intel
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Intel

Celeron

D Processor in the 775-Land LGA Package Thermal Design Guide17

Order #303730

Processor Thermal/Mechanical Information

the amount of system airflow can be traded off against each other to meet specific system design

constraints. Additional constraints are board layout, spacing, component placement, acoustic

requirements and structural considerations that limit the thermal solution size. For more

information, refer to the Performance ATX Desktop System Thermal Design Suggestions or

Performance microATX Desktop System Thermal Design Suggestions documents available on the

http://www.formfactors.org/ web site. For more information on 1U and 2U server refer to the Thin

Electronics Bay Specifications at http://www.ssiforum.org.

In addition to passive heatsinks, fan heatsinks and system fans, other solutions exist for cooling

integrated circuit devices. For example, ducted blowers, heat pipes and liquid cooling are all

capable of dissipating additional heat. Due to their varying attributes, each of these solutions may

be appropriate for a particular system implementation.

To develop a reliable, cost-effective thermal solution, thermal characterization and simulation

should be carried out at the entire system level, accounting for the thermal requirements of each

component. In addition, acoustic noise constraints may limit the size, number, placement, and types

of fans that can be used in a particular design.

To ease the burden on thermal solutions, the Thermal Monitor feature and associated logic have

been integrated into the silicon of the Celeron D Processor in the 775-land LGA package. By

taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution

cost by designing to TDP instead of maximum power. Thermal Monitor attempts to protect the

processor in rare excursions of workload above TDP. Implementation options and

recommendations are described in Section 4.0, “Thermal Management Logic and Thermal

Monitor” on page 23 and Section 4.2.2, “Thermal Control Circuit” on page 24.

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Intel Celeron D Specifications

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