Datasheet 9
Features Summary
1 Features Summary
1.1 Introduction
Intel® Pentium® P6000 and U5000 Mobile Processor Series is the next generation of
64-bit, multi-core mobile processor built on 32-nanometer process technology. Based
on the low-power/high-performance Nehalem micro-architecture, the processor is
designed for a two-chip platform as opposed to the traditional three-chip platforms
(processor, GMCH, and ICH). The two-chip platform consists of a processor and the
Platform Controller Hub (PCH) and enables higher performance, lower cost, easier
validation, and improved x-y footprint. The PCH may also be referred to as Mobile
Intel® 5 Series Chipset (formerly Ibex Peak-M). Intel® Pentium® P6000 and U5000
Mobile Processor Series is designed for the Calpella platform and is offered in rPGA988A
and BGA1288 package respectively.
Included in this family of processors is Intel® HD graphics and memory controller die
on the same package as the processor core die. This two-chip solution of a processor
core die with an integrated graphics and memory controller die is known as a multi-chip
package (MCP) processor.
Note:
1. Throughout this document, Intel® Pentium® P6000 and U5000 Mobile Processor
Series is referred to as processor.
2. Throughout this document, Intel® HD graphics is referred as integrated graphics.
3. Integrated graphics and memory controller die is built on 45-nanometer process
technology
4. Intel® Pentium® P6000 and U5000 Mobile Processor Series is not Intel® vPro™
eligible
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