Intel® Server S2600WF Product Family Configuration Guide
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1U/2U accessory kit
1U/2U spare kit
This accessory kit provides the clip necessary to attach a fabric supported Intel® Xeon® Scalable
processor to the CPU heat sink.
This kit must be ordered to support dual fabric CPU configurations when installing either of the
following IFT Carrier Accessory Kits:
• iPC AWF1PFABKITM
• iPC AWF1PFABKITP
Kit includes: (1) fabric processor clip
Mezzanine Fabric Carrier Kit
This board allows external access to the Intel® Omni-Path Host Fabric Interface (Intel® OP HFI)
of fabric supported processors. The connection to the external access is done through two
QSFP+28 style connections.
The mezzanine fabric carrier board is designed to be mounted within the OCP* module bay of
either the 1U or 2U chassis. All required signals/power for the board are passed through the
included sideband cable.
Kit includes:
(1) – IFT Carrier Mezzanine Board – iPN H88405-xxx
(1) – 235 mm cable (iPN H79272-xxx), 1 port, Mezzanine card to Fabric Processor #1
(1) – 430 mm cable (iPN H77497-xxx), 2x12 HFI Sideband Y Cable, Single Intel® Omni-Path
Sideband IFT Carrier to dual Intel Omni-Path CPU connectors (Mezzanine card to server
board CPU HFI Sideband connectors)
(1) – Fabric Processor Clip (iPN J61895-xxx)
Note: The 4 screws used to mount the IFT Mezzanine card to the OCP Mezz stand-offs are pre-
installed in the chassis/system.
Additional required accessory for dual fabric processor support:
Dual Fabric processor configurations require the following additional accessory kits to be
ordered separately:
• Cable kit AXXCBL370IFPS1 (Mezzanine card to Fabric Processor #2)
• Fabric Processor Clip Kit FXXCPUCLIPF – Used to attach fabric enabled processor to
processor heat sink
Important: This product is only compatible with external Intel Omni-Path passive cables
(copper) and active cables (optical) up to class 3. For a list of recommended cables, contact your
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