Kirisun DP405 - Default Chapter; Table of Contents

DP405 Service Manual
Contents
1. Overview ...................................................................................................................................................... 1
1.1. Scope ..................................................................................................................................................... 1
1.2. Safety Precautions ................................................................................................................................. 1
1.3. Maintenance Service ............................................................................................................................. 1
2. External View and Operation Description ................................................................................................ 2
2.1. External View ......................................................................................................................................... 2
2.2. Operation Description ............................................................................................................................ 2
2.3. LED Indication ....................................................................................................................................... 3
2.4. Basic Operation ..................................................................................................................................... 4
3. Circuit Description ...................................................................................................................................... 4
3.1. Circuit Composition................................................................................................................................ 4
3.2. TX Circuit ............................................................................................................................................... 5
3.3. RX Principle ........................................................................................................................................... 5
3.4. Power Section ........................................................................................................................................ 6
3.5. IC Description ........................................................................................................................................ 6
3.6. Semiconductor Device Description ....................................................................................................... 7
3.6.1. MCU Description ................................................................................................................................. 7
3.6.2. RDA1846S Port Description ............................................................................................................. 10
3.7. Semiconductor Device Feature Description .........................................................................................11
4. Feature Description and Parameter Setting .......................................................................................... 12
4.1. Kill and Remote Monitor ...................................................................................................................... 12
4.2. Scan ..................................................................................................................................................... 13
4.3. Zone ..................................................................................................................................................... 13
4.4. Setting .................................................................................................................................................. 13
4.5. TOT （Time-out-timer） ..................................................................................................................... 14
4.6. Emergency Alarm ................................................................................................................................ 14
4.7. Feature Setting .................................................................................................................................... 15
5. Attaching and Detaching .......................................................................................................................... 15
5.1. Attaching and Detaching the Battery ................................................................................................... 15
5.2. Attaching and Detaching the Antenna ................................................................................................. 16
5.3. Installing the Earphone ........................................................................................................................ 16
5.4. Detaching the Housing from the Chassis (see figure below) .............................................................. 17
5.5. Detaching the Motherboard from the Chassis (see figure below） .................................................... 18
5.6. Exploded View ..................................................................................................................................... 19
6. Modulation and Test ................................................................................................................................. 21
6.1. Method ................................................................................................................................................. 21
6.1.1. Components needed for adjustment ................................................................................................. 21
6.1.2. PC Test Mode Modulation Method: ................................................................................................... 21
6.2.
Radio Test ............................................................................................................................................ 21
7. Main Technical Performance and Specification .................................................................................... 22
8. Maintenance and Test Equipment ........................................................................................................... 23
9. Troubleshooting ........................................................................................................................................ 24
Appendix 1 Abbreviations ........................................................................................................................ 26
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