Lenovo ThinkServer RD350 User Manual

ProductscontainingCR(manganesedioxide)lithiumcoincellbatteriesmaycontainperchlorate.
PerchlorateMaterial-specialhandlingmayapply,See
http://www.dtsc.ca.gov/hazardouswaste/perchlorate
RecyclinginformationforBrazil
DeclaraçõesdeReciclagemnoBrasil
DescartedeumProdutoLenovoForadeUso
Equipamentoselétricoseeletrônicosnãodevemserdescartadosemlixocomum,masenviadosàpontosde
coleta,autorizadospelofabricantedoprodutoparaquesejamencaminhadoseprocessadosporempresas
especializadasnomanuseioderesíduosindustriais,devidamentecertificadaspelosorgãosambientais,de
acordocomalegislaçãolocal.
ALenovopossuiumcanalespecíficoparaauxiliá-lonodescartedessesprodutos.Casovocêpossua
umprodutoLenovoemsituaçãodedescarte,ligueparaonossoSACouencaminheume-mailpara:
reciclar@lenovo.com,informandoomodelo,númerodesérieecidade,afimdeenviarmosasinstruções
paraocorretodescartedoseuprodutoLenovo.
Particulatecontamination
Attention:Airborneparticulates(includingmetalflakesorparticles)andreactivegasesactingaloneorin
combinationwithotherenvironmentalfactorssuchashumidityortemperaturemightposearisktothe
serverthatisdescribedinthisdocument.Risksthatareposedbythepresenceofexcessiveparticulate
levelsorconcentrationsofharmfulgasesincludedamagethatmightcausetheservertomalfunctionor
ceasefunctioningaltogether.Thisspecificationsetsforthlimitsforparticulatesandgasesthatareintended
toavoidsuchdamage.Thelimitsmustnotbeviewedorusedasdefinitivelimits,becausenumerous
otherfactors,suchastemperatureormoisturecontentoftheair,caninfluencetheimpactofparticulates
orenvironmentalcorrosivesandgaseouscontaminanttransfer.Intheabsenceofspecificlimitsthatare
setforthinthisdocument,youmustimplementpracticesthatmaintainparticulateandgaslevelsthatare
consistentwiththeprotectionofhumanhealthandsafety.IfLenovodeterminesthatthelevelsofparticulates
orgasesinyourenvironmenthavecauseddamagetotheserver,Lenovomayconditionprovisionofrepair
orreplacementofserversorpartsonimplementationofappropriateremedialmeasurestomitigatesuch
environmentalcontamination.Implementationofsuchremedialmeasuresisacustomerresponsibility.
Table11.Limitsforparticulatesandgases
ContaminantLimits
Particulate
•Theroomairmustbecontinuouslyfilteredwith40%atmosphericdustspotefficiency
(MERV9)accordingtoASHRAEStandard52.2
1
.
•Airthatentersadatacentermustbefilteredto99.97%efficiencyorgreater,using
high-efficiencyparticulateair(HEPA)filtersthatmeetMIL-STD-282.
•Thedeliquescentrelativehumidityoftheparticulatecontaminationmustbemorethan60%
2
.
•Theroommustbefreeofconductivecontaminationsuchaszincwhiskers.
Gaseous•Copper:ClassG1asperANSI/ISA71.04-1985
3
•Silver:Corrosionrateoflessthan300Åin30days
1
ASHRAE52.2-2008-MethodofTestingGeneralVentilationAir-CleaningDevicesforRemovalEfficiencybyParticle
Size.Atlanta:AmericanSocietyofHeating,RefrigeratingandAir-ConditioningEngineers,Inc.
2
Thedeliquescentrelativehumidityofparticulatecontaminationistherelativehumidityatwhichthedustabsorbs
enoughwatertobecomewetandpromoteionicconduction.
148ThinkServerRD350UserGuideandHardwareMaintenanceManual

Lenovo ThinkServer RD350 Specifications

General

Tcase	72.1 °C
Bus type	QPI
Stepping	R2
FSB Parity	No
Scalability	2S
Processor code	SR206
Processor cache	20 MB
Processor cores	8
Processor model	E5-2630V3
System bus rate	8 GT/s
Processor series	Intel Xeon E5-2600 v3
Processor socket	LGA 2011-v3
Processor threads	16
Processor codename	Haswell
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	52.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	x4, x8, x16
Supported instruction sets	AVX
Thermal Design Power (TDP)	85 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
Maximum number of SMP processors	2
Maximum number of PCI Express lanes	40
Memory types supported by processor	DDR4-SDRAM
Memory channels supported by processor	Quad
Memory clock speeds supported by processor	1600, 1866 MHz
Memory bandwidth supported by processor (max)	59 GB/s
Maximum internal memory supported by processor	768 GB
HDD size	3.5 \
RAID levels	0, 1, 10
Optical drive type	DVD±RW
Internal drive bays	4
Total storage capacity	- GB
Maximum storage capacity	16 TB
Number of HDDs installed	-
Internal memory	8 GB
Memory clock speed	2133 MHz
Maximum internal memory	512 GB
Graphics card	AST2400
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports	3
PCI Express slots version	3.0
Compatible operating systems	Microsoft Windows Server 2012 R2, Microsoft Windows Server 2012, Microsoft Windows Server 2008 R2, SUSE, Linux Enterprise Server, Red Hat Enterprise Linux Server, VMware ESXi
Chassis type	Rack (1U)
Power supply	750 W
Processor ARK ID	83356
Intel Secure Key Technology version	1.00
Intel Identity Protection Technology version	0.00
Operating altitude	0 - 3048 m
Storage temperature (T-T)	-10 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	8 - 90 %

Weight and Dimensions

Depth	803 mm
Width	482 mm
Height	43 mm