Microhard Systems pMDDL2350 - Heat Dissipation

© Microhard 27
3.0 Hardware Features
3.1.7 Heat Dissipation
For optimal performance it is important to include adequate heat dissipation strategies that
incorporate a heat sink or fan into any designs that integrate the pMDDL OEM module (also
required for designs that utilize the optional socket).
Below are two recommended heat dissipation strategies:
Heat Sink (w/Thermal Gap Filler)
Fan (Requires power source)
Heat Sink - Wakefield-Vette 625-25ABT4E*
25mm x 25mm x 6.4mm (Fin height)
12
0
C/W @ 500 LFM
5.45 grams
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Thermal Gap Filler - Laird Technologies Tflex HR600*
25mm x 25 mm (Cut to Size)
5mm Thickness
3.0 W/m-K
5 grams
_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
pMDDL OEM or OEM/Socket
External Fan - Sunon MC25100V1-000U-A99*
25mm x 25mm x 10mm
3.5 CFM (0.099m
3
/min)
13,000 RPM
2.5~6VDC
7.71 grams
_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
pMDDL OEM or OEM/Socket
* Or equivalent